相关论文: Two-Phase Boiling in a Replaceable Embedded Heat S…
This paper presents the latest progress on characterization of our membrane assisted phase-change heat sink (MHS) at conditions suitable for implementation in data centers (DCs). Experiments are conducted using water as the working fluid at…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
Water can be transitioned to an enhanced heat-conducting phase by supercooling only the water at the bottom of a container. The temperature gradient across the 4 cm in the center of an 8 cm long column of water with a 397 mW heat source at…
Pool boiling is one of the efficient ways to remove heat from high-power electronics, heat exchangers, and nuclear reactors. Nowadays, the pool boiling method is tried to exercise frequently due to its ability to remove high heat flux…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
In this paper, a 3D conjugated heat transfer model for Nano-Encapsulated Phase Change Materials (NEPCMs) cooled Micro Pin Fin Heat Sink (MPFHS) is presented. The governing equations of flow and heat transfer are solved using a finite volume…
Superconducting microwave circuits show great potential for practical quantum technological applications such as quantum information processing. However, fast and on-demand initialization of the quantum degrees of freedom in these devices…
Circuit-based quantum devices rely on keeping electrons at millikelvin temperatures. Improved coherence and sensitivity as well as discovering new physical phenomena motivate pursuing ever lower electron temperatures, accessible using…
In electronic cooling with superconducting tunnel junctions, the cooling power is counterbalanced by the interaction with phonons and by the heat flow from the overheated leads. We study aluminium-based coolers that are equipped with a…
We demonstrate active embedded microfluidic cooling in $\beta$-Ga$_2$O$_3$. We employ a cost-effective infra-red laser etch setup to achieve controlled etching of micro-channels in 500 um thick $\beta$-Ga$_2$O$_3$ substrate. The…
Many computational studies on hotspot microfluidic cooling devices found in the literature rely on simplified assumptions and conventions that do not capture the full complexity of the conjugate thermal problem, such as constant…
Mist/air two-phase flow is a promising cooling technique for many applications such as internal cooling of gas turbine blades. A significant enhancement of heat transfer can be achieved with a low mass fraction of droplets by utilizing the…
Compact and small-scale heat exchangers can handle high heat dissipation rates due to their large surface area to volume ratios. Applications involving high heat dissipation rates include, but are not limited to, compact microelectronic…
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to…
The readout electronics of a Micromegas (MM) module consume nearly 26 W of electric power, which causes the temperature of electronic board to increase upto $70\,^{\circ}{\rm C}$. Increase in temperature results in damage of electronics.…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
In this paper, we describe a mathematical model and a numerical simulation method for the condenser component of a novel two-phase thermosyphon cooling system for power electronics applications. The condenser consists of a set of…
The paper presents numerical results on an innovative concept of an efficient, site-specific cooling technology for microprocessor hot spots using Alternating Current Electrothermal Flow (ACET). ACET deploys an electrokinetic transport…
We present an approach to construct position-sensitive silicon detectors with an integrated cooling circuit. Tests on samples demonstrate that a very modest liquid flow very effectively cool the devices up to a power dissipation of over…
Developing high power density electronics requires effective and highly reliable cooling techniques with low thermal resistance and high heat removal capacity. Loop heat pipes (LHPs) are one kind of two-phase heat transfer device which can…