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Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted…

With the rapid rise of 3D-printing as a competitive mass manufacturing method, manual "decaking" - i.e. removing the residual powder that sticks to a 3D-printed part - has become a significant bottleneck. Here, we introduce, for the first…

Flexible microelectronics has shown tremendous promise in a broad spectrum of applications, especially those that cannot be addressed by conventional microelectronics in rigid materials and constructions1-3. These unconventional yet…

The wide adoption of thermoplastic composites to reduce weight in structural parts requires reliable numerical methods to account for debonding between overmolded parts. Although cohesive elements are effective for debonding, the need for…

The use of Printed Circuit Boards (PCBs) for the inductive pick-up windings of rotating coil probes has made the construction of these precision magnetic measurement devices much more accessible. This paper discusses the design details for…

Additive manufacturing, or 3D printing, is a complex process that creates free-form geometric objects by sequentially placing material to construct an object, usually in a layer-by-layer process. One of the most widely used methods is Fused…

This paper introduces a new method of paper circuit fabrication that overcomes design barriers and increases flexibility in circuit design. Conventional circuit boards rely on thin traces, which limits the complexity and accuracy when…

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify…

The development of stretchable and flexible electronics based on soft polymeric substrates requires novel approaches in the design, fabrication, integration, and packaging of passive and active electronic components. Here we demonstrate the…

Microwave filtering for superconducting qubits is a key element of quantum computing technology, enabling high coherence and fast state detection. This work presents the design and implementation of novel microwave Purcell filters for…

3D print is a recently developed technique, for single-unit production, and for structures that have been impossible to build previously. The current work presents a method to 3D print polymer bonded isotropic hard magnets with a low-cost,…

With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…

As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…

The development of cost-effective highperformance parallel computing on multi-processor supercomputers makes it attractive to port excessively time consuming simulation software from personal computers (PC) to super computes. The power…

The System-by-Design (SbD) is an emerging engineering framework for the optimization-driven design of complex electromagnetic (EM) devices and systems. More specifically, the computational complexity of the design problem at hand is…

This study starts from the counter-intuitive question of how we can render a conventional stiff, non-stretchable and even brittle material conformable so that it can fully wrap around a curved surface, such as a sphere, without failure.…

We present a systematic, computationally efficient approach for synthesizing 3D-printable all-dielectric devices. Inverse-design optimization methods lead to devices of a continuous dielectric constant profile with complex and conformal…

Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been…

Product codes (PCs) protect a two-dimensional array of bits using short component codes. Assuming transmission over the binary symmetric channel, the decoding is commonly performed by iteratively applying bounded-distance decoding to the…