相关论文: US Microelectronics Packaging Ecosystem: Challenge…
Semiconductor innovation drives improvements to technologies that are critical to modern society. The country that successfully accelerates semiconductor innovation is positioned to lead future semiconductor-driven industries and benefit…
Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of…
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture…
Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings…
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…
Organizations increasingly need to reassess their supply chain strategies in the rapidly modernizing world towards sustainability. This is particularly true in the United States, where supply chains are very extensive and consume a large…
The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs…
Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are…
Semiconductor manufacturing is a notoriously complex and costly multi-step process involving a long sequence of operations on expensive and quantity-limited equipment. Recent chip shortages and their impacts have highlighted the importance…
Reliability has become an increasing concern in modern computing. Integrated circuits (ICs) are the backbone of modern computing devices across industries, including artificial intelligence (AI), consumer electronics, healthcare,…
The emergence of chiplet-based heterogeneous integration is transforming the semiconductor, AI, and high-performance computing industries by enabling modular designs and improved scalability. However, assembling chiplets from multiple…
The increasing demands for computing performance have been a reality regardless of the requirements for smaller and more energy efficient devices. Throughout the years, the strategy adopted by industry was to increase the robustness of a…
Consumer and defense systems demanded design and manufacturing of electronics with increased performance, compared to their predecessors. As such systems became ubiquitous in a plethora of domains, their application surface increased, thus…
The world of computing is in rapid transition, now dominated by a world of smartphones and cloud services, with profound implications for the future of advanced scientific computing. Simply put, high-performance computing (HPC) is at an…
To reduce the cost of ICs and to meet the market's demand, a considerable portion of manufacturing supply chain, including silicon fabrication, packaging and testing may be pushed offshore. Utilizing a global IC manufacturing supply chain,…
The globalization of the semiconductor industry has introduced security challenges to Integrated Circuits (ICs), particularly those related to the threat of Hardware Trojans (HTs) - malicious logic that can be introduced during IC…
The field of mimicking the structure of the brain on a chip is experiencing interest driven by the demand for machine intelligent applications. However, the power consumption and available performance of machine-learning (ML) accelerating…
The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional photonic integration have emerged as promising…
Increasing data rates, spectrum efficiency and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, 5G networks have…
As with most aspects of electronic systems and integrated circuits, hardware security has traditionally evolved around the dominant CMOS technology. However, with the rise of various emerging technologies, whose main purpose is to overcome…