相关论文: Explicit relationship between electrical and topol…
Crack-templated networks, metallic frameworks fabricated from crack patterns in sacrificial thin films, can exhibit high optical transmittance, high electric conductivity, and a host of other properties attractive for applications. Despite…
Crack-template-based transparent conductive films (TCFs) are promising kinds of junction-free, metallic network electrodes that can be used, e.g., for transparent electromagnetic interference (EMI) shielding. Using image processing of…
This work is devoted so show the appearance of different cracking modes in linearly elastic thin film systems by means of an asymptotic analysis as the thickness tends to zero. By superposing two thin plates, and upon suitable scaling law…
A large electric field is typically present in anodic or passive oxide films. Stresses induced by such a large electric field are critical in understanding the breakdown mechanism of thin oxide films and improving their corrosion…
Several experiments have demonstrated the existence of an electro-mechanical effect in many biological tissues and hydrogels, and its actual influence on growth, migration, and pattern formation. Here, to model these interactions and…
Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically…
Effects of periodic curvature on the the electrical resistivity of corrugated semiconductor films are theoretically considered. The presence of a curvature-induced potential affects the motion of electrons confined to the thin curved film,…
Polygonal desiccation crack patterns are commonly observed in natural systems. Despite their quotidian nature, it is unclear whether similar crack patterns which span orders of magnitude in length scales share the same underlying physics.…
By studying the temperature-dependent behavior of electron thermal conductivity (k) in a 3.2 nm-thin film, we quantify the extremely confined defect-electron scattering and reveal the intrinsic phonon-electron scattering that is shared by…
For solving the longstanding materials science problem of correlating elastic properties of a solid material to the formation of cracks we present a new general concept. This concept is applied to the technologically most important cracks…
The miniaturization of electronic devices has led to the prominence, in technological applications, of semiconductor thin films that are only a few nanometers thick. In spite of intense research, the thickness-dependent resistivity or…
A continuum model of fracture that describes, in principle, the propagation and interaction of arbitrary distributions of cracks and voids with evolving topology without a fracture criterion is developed. It involves a 'law of motion' for…
Crumpling of a thin film leads to a unique stiff yet lightweight structure. The stiffness has been attributed to a complex interplay between four basic elements - smooth bends, sharp folds, localized points (developable cones), and…
Fracture of materials with rate-dependent mechanical behaviour, e.g. polymers, is a highly complex process. For an adequate modelling, the coupling between rate-dependent stiffness, dissipative mechanisms present in the bulk material and…
The electrical resistivity of a pure sample of a thin metallic film is found to depend on the boundary conditions. This conclusion is supported by a free-electron model calculation and confirmed by an ab initio relativistic…
The low-temperature electrical resistivity of corrugated semiconductor films is theoretically considered. Nanoscale corrugation enhances the electron-electron scattering contribution to the resistivity, resulting in a stepwise resistivity…
We report results on the interrelation between driving force, roughness exponent, branching and crack speed in a finite element model. We show that for low applied loadings the crack speed reaches the values measured in the experiments, and…
We study Coulomb drag between the top and bottom surfaces of topological insulator films. We derive a kinetic equation for the thin-film spin density matrix containing the full spin structure of the two-layer system, and analyze the…
Compression-induced buckling instability of metal thin films on a compliant base result in surface wrinkles. A stiff thin film, perfectly bonded to an infinitely deep pre-stretched dielectric elastomer (DE) substrate, is considered. Linear…
Using Monte Carlo simulation, we studied the electrical conductance of two-dimensional films. The films consisted of a poorly conductive host matrix and highly conductive rodlike fillers (rods). The rods were of various lengths, obeying a…