相关论文: Improving the Resolution and Throughput of Achroma…
Developing a suitable production method for three-dimensional periodic nanostructures with high aspect ratios is a subject of growing interest. For mass production, Talbot lithography offers many advantages. However, one disadvantage is…
Mask-based pattern generation is a crucial step in microchip production. The next-generation extreme-ultraviolet- (EUV) lithography instruments with a wavelength of \SI{13.5}{\nano\meter} is currently under development. In principle, this…
Conventional projection Talbot lithography usually employs opaque (amplitude) or transparent (phase) masks for creating a periodic array of Fresnel diffraction fringes in the photosensitive substrate. For particular mask design the…
Despite the fact that the resolution of conventional contact/proximity lithography can reach feature sizes down to ~0.5-0.6 micrometers, the accurate control of the linewidth and uniformity becomes already very challenging for gratings with…
The future success of integrated circuits (IC) technology relies on the continuing miniaturization of the feature size, allowing more components per chip and higher speed. Extreme anisotropy opens new opportunities for spatial pattern…
In classical binary holography, a target pattern located at infinity is generated by the diffraction of a plane wave passing through a binary mask with holes of the same size, placed at specific positions of a rectangular grid. Fresnel…
We report a novel extension to structured illumination (SI) microscopy that utilizes the Talbot self-imaging effect to generate a SI pattern on a sample with field-of-view (FOV) and resolution unconstrained by the numerical aperture (NA) of…
Extreme ultraviolet (EUV) lithography is the cornerstone of the fabrication of advanced integrated circuits at the 7-nm node and beyond, but its reliance on multi-element reflective projection optics makes it inaccessible for small-scale…
Colloidal lithography has emerged as a promising alternative to conventional nanofabrication techniques, offering the ability to create nanoscale patterns in a cost-effective and scalable manner. However, it has been so far limited by…
Achieving fast and continuous fabrication of large-scale complex 3D structures is key to unlocking industrial-scale adoption of two-photon lithography (TPL). Despite substantial improvement in peak optical patterning rates enabled by recent…
A systematic review, covering fabrication of nanoscale patterns by laser interference lithography (LIL) and their applications for optical devices are provided. LIL is a patterning method with simple, quick process over a large area without…
We have been developing an x-ray imaging system, Multi-Image X-ray Interferometer Module (MIXIM), to achieve a high angular resolution with a compact system size. MIXIM is comprised of a mask with equally-spaced apertures and an x-ray…
Laser Interference Lithography (LIL) is a versatile fabrication method for patterning sub-micron structures in arrays covering large areas. It is a facile and fast mask-less lithography process to produce large area periodic patterns. The…
Triple patterning lithography (TPL) has been recognized as one of the most promising solutions to print critical features in advanced technology nodes. A critical challenge within TPL is the effective assignment of the layout to masks.…
To overcome the limit of diffraction while achieving the superresolution technique, solid immersion lenses are the key optical elements for data storage and nanophotonics applications. Recent demonstrations have shown how different…
Extreme ultraviolet (EUV) lithography is the leading lithography technique in CMOS mass production, moving towards the sub-10 nm half-pitch (HP) regime with the ongoing development of the next generation high-numerical aperture (high-NA)…
The most direct definition of a patterning process' resolution is the smallest half-pitch feature it is capable of transferring onto the substrate. Here we demonstrate that thermal Scanning Probe Lithography (t-SPL) is capable of…
High-resolution lithographic techniques are often limited by low volumetric throughput, since there is no universal and scalable manufacturing process that can produce 3D metasurfaces. In this work, we demonstrate a high-speed holographic…
Talbot length, the distance between two consecutive self-image planes along the propagation axis for a periodic diffraction object (grating) illuminated by a plane wave, depends on the period of the object and the wavelength of…
As the feature size of integrated circuits continues to decrease, optical proximity correction (OPC) has emerged as a crucial resolution enhancement technology for ensuring high printability in the lithography process. Recently, level…