相关论文: Adaptive 3D-IC TSV Fault Tolerance Structure Gener…

Reliability has taken centre stage in the development of high-performance computing processors. A Surge of interest is noticeable in recent times in formulating fault and failure models, understanding failure mechanism and strategizing…

3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…

This paper continues to develop a fault tolerant extension of the sparse grid combination technique recently proposed in [B. Harding and M. Hegland, ANZIAM J., 54 (CTAC2012), pp. C394-C411]. The approach is novel for two reasons, first it…

The Network-on-Chips is a promising candidate for addressing communication bottlenecks in many-core processors and neural network processors. In this work, we consider the generalized fault-tolerance topology generation problem, where the…

Reverse engineering can be used to derive a 3D model of an existing physical part when such a model is not readily available. For parts that will be fabricated with subtractive and formative manufacturing processes, existing reverse…

The study of fault-tolerant data structures for various network design problems is a prominent area of research in computer science. Likewise, the study of NP-Complete problems lies at the heart of computer science with numerous results in…

In dynamic systems that adapt to users' needs and changing environments, dependability needs cannot be avoided. This paper proposes an orthogonal fault tolerance model as a means to manage and reason about multiple fault tolerance…

Signal Temporal Logic (STL) specifications play a crucial role in defining complex temporal properties and behaviors in safety-critical cyber-physical systems (CPS). However, fault diagnosis (FD) and fault-tolerant control (FTC) for CPS…

The structures for the expression of fault-tolerance provisions into the application software are the central topic of this paper. Structuring techniques answer the questions "How to incorporate fault-tolerance in the application layer of a…

Fault tolerance is a critical aspect of modern computing systems, ensuring correct functionality in the presence of faults. This paper presents a comprehensive survey of fault tolerance methods and software-based mitigation techniques in…

Environmental noise (e.g.heat, ionized particles, etc.) causes transient faults in hardware, which lead to corruption of stored values. Mission-critical devices require such faults to be mitigated by fault-tolerance --- a combination of…

The focus of this paper is an integrated, fault-tolerant vehicle supervisory control algorithm for the overall stability of ground vehicles. Vehicle control systems contain many sensors and actuators that can communicate with each other…

Energy increasingly constrains modern computer hardware, yet protecting computations and data against errors costs energy. This holds at all scales, but especially for the largest parallel computers being built and planned today. As…

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…

Fault tolerance is increasingly being use to design Dependable Digital Systems (DDS), which refers to the capability of a system to keep performing its intended functions in existence of faults. DDS are typically used in Safety-critical…

This paper examines the problem of introducing advanced forms of fault-tolerance via reconfiguration into safety-critical avionic systems. This is required to enable increased availability after fault occurrence in distributed integrated…

Making a product conform to the functional requirements indicated by the customer suppose to be able to manage the manufacturing process chosen to realise the parts. A simulation step is generally performed to verify that the expected…

Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) adopted by commercial software can provide accurate…

Fast machine code generation is especially important for fast start-up just-in-time compilation, where the compilation time is part of the end-to-end latency. However, widely used compiler frameworks like LLVM do not prioritize fast…

The structures for the expression of fault-tolerance provisions into the application software are the central topic of this dissertation. Structuring techniques provide means to control complexity, the latter being a relevant factor for the…