相关论文: Smart packaging of electronics and integrated MEMS…
The pervasive need to safely share and store information between devices calls for the replacement of centralized trust architectures with the decentralized ones. Distributed Ledger Technologies (DLTs) are seen as the most promising enabler…
In this paper, we report on a multicore fiber-based (MCF) temperature sensor that operates in a wide thermal range and that is robustly packaged to withstand harsh environments. To develop the sensor, the fundamentals concerning the effect…
A maskless post-processing technique for CMOS chips is developed that enables the fabrication of RF MEMS parallel-plate capacitors with a high quality factor and a very compact size. Simulations and measured results are presented for…
We present the technology of obtaining and the electrophysical properties of a multicomponent material 0.61PMN-0.20PT-0.09PS-0.1PFN:Li (PMN-PT-PS-PFN:Li). The addition of PFN into PMN-PT decreases the temperature of final sintering which is…
As the CMOS technology enters nanometer scales, integrated circuits (ICs) become increasingly sensitive to radiation-induced soft errors, which can corrupt the state of storage elements and cause severe reliability issues. Many hardened…
A simple circuit for the presentation of the signals from Multi-gap Resistive Plate Chambers (MRPCs) to standard existing digitization electronics is described. The circuit is based on "off-the-shelf" discrete components. An optimization of…
Semiconductors with very low lattice thermal conductivities are highly desired for applications relevant to thermal energy conversion and management, such as thermoelectrics and thermal barrier coatings. Although the crystal structure and…
In MEMS technology, most of the devices are fabricated on glass or silicon substrate. However, this research presents a novel manufacture method that is derived from conventional hot embossing technology to fabricate the electrostatic…
Metamaterials and metasurfaces have given possibilities for manipulating electromagnetic (EM) waves that in the past would have seemed impossible. The majority of metasurface designs are suitable for a particular frequency and angle of…
Metal-coated microsphere monolayers (MCM) are a class of plasmonic crystals consisting of noble metal films over arrays of self-assembled colloidal microspheres. Despite their ease of fabrication and tunable plasmonic response, their…
Monolithic integration of multiband (1.4~ 6.0 GHz) RF acoustic devices were successfully demonstrated within the same process flow by using the lithium niobate (LN) thin film on silicon carbide (LNOSiC) substrate. A novel surface mode with…
Integrated photonics offers great potential for quantum communication devices in terms of complexity, robustness and scalability. Silicon photonics in particular is a leading platform for quantum photonic technologies, with further benefits…
Intelligent surfaces have emerged as a promising solution to enhance coverage and mitigate signal fading in future wireless communication systems, thereby improving bandwidth and data rates. Passive intelligent surfaces, in particular,…
As two-dimensional metamaterials, metasurfaces open up new avenues for designing static planar optics. However, the dynamic modulation of metasurfaces in the optical band is required for practical applications. The existing dynamic devices…
Recent advances in engineered gradient metasurfaces have enabled unprecedented opportunities for light manipulation using optically thin sheets, such as anomalous refraction, reflection, or focusing of an incident beam. Here we introduce a…
Latent Thermal Energy Storages (LTES) can store thermal energy in a narrow temperature range. Therefore, they are favorable for integration into Rankine-based Carnot Batteries. For the design of such systems, simulations based on accurate…
Major challenges of micro thermal machines are the thermal insulation and mechanical tolerance in the case of sliding piston. Switching from piston to membrane in microengines can alleviate the latest and lead to planar architectures.…
Antiferromagnetic transition metal oxides are an established and widely studied materials system in the context of spin-based electronics, commonly used as passive elements in exchange bias-based memory devices. Currently, major interest…
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to…
We propose lyotropic chromonic liquid crystals (LCLCs) as a distinct class of materials for organic electronics. In water, the chromonic molecules stack on top of each other into elongated aggregates that form orientationally ordered…