相关论文: Direct strain and slope measurement using 3D DSPSI
Large variety of optical full-field measurement techniques are being developed and applied to solve mechanical problems. Since each technique possess its own merits, it is important to know the capabilities and limitations of such…
This Paper introduces a new Non-Contact, Optical method for displacement measurements, and strain mapping as well as comparing it to traditional Digital Image correlation (DIC) and laser interferometry measurement method. This Method…
We have developed a new technique called Direct Shear Mapping (DSM) to measure gravitational lensing shear directly from observations of a single background source. The technique assumes the velocity map of an un-lensed, stably-rotating…
We describe the capability of a high-resolution three-dimensional digital image correlation (DIC) system specifically designed for high strain-rate experiments. Utilising open-source camera calibration and two-dimensional DIC tools within…
We propose a nonlocal strain measure for use with digital image correlation (DIC). Whereas the traditional notion of compatibility (strain as the derivative of the displacement field) is problematic when the displacement field varies…
We reconstruct a 3D model of the surface of a material undergoing fatigue testing and experiencing cracking. Specifically we reconstruct the surface depth (out of plane intrusions and extrusions) and lateral (in-plane) motion from multiple…
Two-dimensional digital image correlation (2D-DIC) is a widely used optical technique to measure displacement and strain during asphalt concrete (AC) testing. An accurate 2-D DIC measurement can only be achieved when the camera's principal…
We introduce "microdeflectometry", a novel technique for measuring the microtopography of specular surfaces. The primary data is the local slope of the surface under test. Measuring the slope instead of the height implies high information…
The direct analysis of the dynamic response of materials is possible using Split Hopkinson pressure bar method. For soils, it has to be adapted since the specimen has generally poor mechanical properties. An original experimental…
Background: Full-field, quantitative visualization techniques, such as digital image correlation (DIC), have unlocked vast opportunities for experimental mechanics. However, DIC has traditionally been a surface measurement technique, and…
Strain has a strong effect on the properties of materials and the performance of electronic devices. Their ever shrinking size translates into a constant demand for accurate and precise measurement methods with very high spatial resolution.…
Geometric metrology includes one or two-dimensional (1D or 2D) distance or plane measurements, as well as the three-dimensional (3D) scanning. The 1D or 2D measuring system is unable to obtain advanced 3D feature, while the 3D scanning…
A direct sampling method (DSM) is designed herein for a real-time detection of small anomalies from scattering parameters measured by a small number of dipole antennas. Applicability of the DSM is theoretically demonstrated by proving that…
In this work, we present a novel approach to process the DIC measurements of multiple biaxial stretching protocols. In particular, we develop a optimization-based approach, which calculates the smoothed nodal displacements using a moving…
Optical instruments for measuring surface-wave characteristics provide a better spatial and temporal resolution than other methods, but they face difficulties while converting the results of indirect measurements into absolute levels of the…
Accurate characterization of heat transport across solid-liquid interfaces is essential for thermal management in micro and nanoscale systems. Yet existing techniques often require prior knowledge of liquid properties, which complicates the…
We study the fractal properties of the 2d discrete scale invariant (DSI) rough surfaces. The contour lines of these rough surfaces show clear DSI. In the appropriate limit the DSI surfaces converge to the scale invariant rough surfaces. The…
Hyperspectral 3D imaging captures both depth maps and hyperspectral images, enabling comprehensive geometric and material analysis. Recent methods achieve high spectral and depth accuracy; however, they require long acquisition times often…
Qualifying the discrepancy between 3D geometric models, which could be represented with either point clouds or triangle meshes, is a pivotal issue with board applications. Existing methods mainly focus on directly establishing the…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…