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相关论文: Fabrication of Switches on Polymer-Based by Hot Em…

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We report on the development of some process capabilities for a polymer-based, multi-layer microelectrofluidic platform, namely: the hot embossing process, metallization on polymer and polymer bonding. Hot embossing experiments were…

其他计算机科学 · 计算机科学 2007-11-29 S. -H. Ng , Z. -F. Wang , R. -T. Tjeung , N. De Rooij

In large area micro hot embossing, the process temperature plays a critical role to both the local fidelity of microstructure formation and global uniformity. The significance of low temperature hot embossing is to improve global flatness…

其他计算机科学 · 计算机科学 2008-02-22 X. C. Shan , Y. C. Liu , H. J. Lu , Z. F. Wang , Y. C. Lam

This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180 degrees C based on nickel plating and photoresist sacrificial layers. The advantages of…

其他计算机科学 · 计算机科学 2007-11-29 R. Hellin-Rico , J. -P. Celis , K. Baert , C. Van Hoof , A. Witvrouw

Active microelectromechanical systems can couple the nanomechanical domain with the electronic domain by integrating electronic sensing and actuation mechanisms into the micromechanical device. This enables very fast and sensitive…

We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With…

其他计算机科学 · 计算机科学 2008-02-22 S. H. Ng , R. T. Tjeung , Z. F. Wang , A. C. W. Lu , I. Rodriguez , N. De Rooij

A thermal position sensor was fabricated and evaluated. The device consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A novel fabrication technology was implemented which allows direct…

综合物理 · 物理学 2008-01-08 A. Petropoulos , G. Kaltsas , D. Goustouridis , A. G. Nassiopoulou

Robotic stacking of van der Waals heterostructures has been at the verge thanks to the convergence between artificial intelligence (AI) and two-dimensional (2D) materials research. Key ingredients to fulfill this pursuit often include…

材料科学 · 物理学 2026-01-15 Zhili Lin , Luosha Han , Jinkun He , Xiaoxue Fan , Tongyao Zhang , Xiaoxi Li , Baojuan Dong , Kai Zhao

Bonding between polymeric interfaces is encountered widely in several industrial applications. Many of these bonding processes rely on time-consuming and temperature-dependent classical mechanism of polymer interdiffusion via reptation in a…

软凝聚态物质 · 物理学 2022-05-10 Nikhil Padhye , Ajay Vallabh

Understanding microstructural evolution under extreme thermal conditions is essential for advancing metal additive manufacturing (AM). This work demonstrates the feasibility of employing micro-electro-mechanical system (MEMS) heating…

材料科学 · 物理学 2026-01-12 C. Koenig , P. Mayr , J. R. Jinschek , A. Bastos Fanta

Microelectromechanical systems (MEMS) technologies are developing rapidly with increasing study of the design, fabrication and commercialization of microscale systems and devices. Accurate knowledge on the mechanical behaviors of thin film…

其他计算机科学 · 计算机科学 2008-02-22 Ming-Tzer Lin , K. -S. Shiu , Chi-Jia Tong

Bicontinuous microstructures are essential to the function of diverse natural and synthetic systems. Their synthesis has been based on two approaches: arrested phase separation or self-assembly of block copolymers. The former is attractive…

We have designed and characterized micro-electro-mechanical systems (MEMS) for applications at low temperatures. The mechanical resonators were fabricated using a surface micromachining process. The devices consist of a pair of parallel…

介观与纳米尺度物理 · 物理学 2013-01-24 M. Gonzalez , P. Zheng , E. Garcell , Y. Lee , H. B. Chan

The aim of this paper is to deal with multi-physics simulation of micro-electro-mechanical systems (MEMS) based on an advanced numerical methodology. MEMS are very small devices in which electric as well as mechanical and fluid phenomena…

其他计算机科学 · 计算机科学 2007-11-29 V. Rochus , J. -C. Golinval , C. Louis , C. Mendez , I. Klapka

We report on the hot roller embossing of polymer sheets for the creation of microfluidic structures. Measurements conducted on 100 $\mu$m features showed that the lateral dimensions could be replicated to within 2% tolerance, while over 85%…

其他计算机科学 · 计算机科学 2008-12-18 Sum Huan Ng , Zhenfeng Wang

A direct electronics printing technique through atomized spraying for patterning room temperature liquid metal droplets on desired substrate surfaces is proposed and experimentally demonstrated for the first time. This method has…

材料科学 · 物理学 2015-06-17 Qin Zhang , Yunxia Gao , Jing Liu

Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the…

其他计算机科学 · 计算机科学 2008-02-22 H. Kirchberger , P. Lindler , M. Wimpliger

This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…

综合物理 · 物理学 2008-01-08 H. Chen , L. Hsu , X. Wei

We report a new technique for fabricating metallic electrodes on insulating substrates with separations on the 1 nm scale. The fabrication technique, which combines lithographic and electrochemical methods, provides atomic resolution…

材料科学 · 物理学 2009-10-31 A. F. Morpurgo , D. B. Robinson , C. M. Marcus

Widespread adoption of high-temperature polymer electrolyte membrane fuel cells (HT-PEMFCs) and HT-PEM electrochemical hydrogen pumps (HT-PEM ECHPs) requires models and computational tools that provide accurate scale-up and optimization.…

机器学习 · 计算机科学 2022-03-01 Luis A. Briceno-Mena , Christopher G. Arges , Jose A. Romagnoli

In this study, a method for fabrication of superconducting microstructures that are partially or completely isolated from the substrate has been proposed. Two configurations of suspended microbridges have been suggested, i. e., the first…

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