相关论文: Electromechanical Reliability Testing of Three-Axi…
We investigate, assess, and suggest possibilities for a measurement of the local spin susceptibility of a conducting low-dimensional electron system. The basic setup of the experiment we envisage is a source-probe one. Locally induced spin…
Accurate force sensing is important for endoluminal intervention in terms of both safety and lesion targeting. This paper develops an FBG-based force sensor for robotic bronchoscopy by configuring three FBG sensors at the lateral side of a…
Electrostatic sensing technology is widely utilized in both military and civilian applications, including electrostatic prevention in gas stations and various electronic devices. The high sensitivity of electrostatic sensor is capable to…
Using light as a probe to detect a mechanical motion is one of the most successful experimental approaches in physics. The history of mechanical sensing based on the reflection, refraction and scattering of light dates back to the 16th…
The availability of compact, low-cost magnetic resonance imaging instruments would further broaden the substantial impact of this technology. We report highly sensitive detection of magnetic resonance using low-stress silicon nitride…
We describe a method with which to fabricate sub-micron mechanical structures from silicon-on-insulator substrates. We believe this is the first reported method for such fabrication, and our technique allows for complex, multilayer electron…
This paper presents a novel design for a compact, lightweight 6-axis force/torque sensor intended for use in legged robots. The design promotes easy manufacturing and cost reduction, while introducing innovative calibration methods that…
Silicon carbide is a hard, semiconducting material presenting many polytypes, whose behavior under extreme conditions of pressure and temperature has attracted large interest. Here we study the mechanical properties of 3C-SiC over a wide…
The development of wearable sensing systems for sports performance tracking, rehabilitation, and injury prevention has driven growing demand for smart garments that combine comfort, durability, and accurate motion detection. This paper…
Quantum fluctuations give rise to van der Waals and Casimir forces that dominate the interaction between electrically neutral objects at sub-micron separations. Under the trend of miniaturization, such quantum electrodynamical effects are…
Piezoelectric quartz tuning forks have been employed as the force sensor in a dynamic mode scanning force microscope operating at temperatures down to 1.7 K at He-gas pressures of typically 5 mbar. An electrochemically etched tungsten tip…
The absence of piezoelectricity in silicon makes direct electro-mechanical applications of this mainstream semiconductor impossible. Integrated electrical control of the silicon mechanics, however, would open up new perspectives for on-chip…
The dynamic properties of materials utilized in architecture or engineering applications can significantly affect their performance under dynamic or impact loading conditions. To evaluate such behavior, force transducers are commonly…
Effective force modulation during tissue manipulation is important for ensuring safe robot-assisted minimally invasive surgery (RMIS). Strict requirements for in-vivo distal force sensing have led to prior sensor designs that trade off ease…
We measure and model electroadhesion across multi-asperity silicon interfaces with nanometer scale roughness. When electrically biased, our naturally oxidized silicon interfaces display a leakage current consistent with the Fowler-Nordheim…
This chapter describes the basic design, simulation, and fabrication for fully Si integrated, waveguide coupled, optomechanical force and displacement sensors. The approach of full Si integration of all stationary nanophotonic components…
A key challenge in performing experiments with microparticles is controlling their adhesion to substrates. For example, levitation of a microparticle initially resting on a surface requires overcoming the surface adhesion forces to deliver…
Electronic devices exhibit changes in electrical resistance over time at varying rates, depending on the configuration of certain components. Since measuring overall electrical resistance requires partial disassembly, only a limited number…
Active microelectromechanical systems can couple the nanomechanical domain with the electronic domain by integrating electronic sensing and actuation mechanisms into the micromechanical device. This enables very fast and sensitive…
The timing performance of silicon sensors bump-bonded to Timepix3 ASICs is investigated, prior to and after different types of irradiation up to $8 \times 10^{15} 1 \mathrm{\,Me\kern -0.1em V} \mathrm{ \,n_{eq}} {\mathrm{ \,cm}}^{-2}$. The…