相关论文: Temperature measurement in the Intel(R) CoreTM Duo…
Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal…
The increase in dissipated power per unit area of electronic components sets higher demands on the performance of the heat sink. Also if we continue at our current rate of miniaturisation, laptops and other electronic devices can get heated…
The magnitude of the real-time digital signal processing challenge attached to large radio astronomical antenna arrays motivates use of high performance computing (HPC) systems. The need for high power efficiency (performance per watt) at…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
This paper addresses the design and implementation of a real time temperature monitoring system with applications in telemedicine. The system consists of a number of precision wireless thermometers which are conceived and realized to…
Room temperature operation is mandatory for any optoelectronics technology which aims to provide low-cost compact systems for widespread applications. In recent years, an important technological effort in this direction has been made in…
This paper explores the potential of cryogenic semiconductor computing and superconductor electronics as promising alternatives to traditional semiconductor devices. As semiconductor devices face challenges such as increased leakage…
Optimizing task-to-core allocation can substantially reduce power consumption in multi-core platforms without degrading user experience. However, existing approaches overlook critical factors such as parallelism, compute intensity, and…
In High Performance Computing, systems are evaluated based on their computational throughput. However, performance in contemporary server processors is primarily limited by power and thermal constraints. Ensuring operation within a given…
There is much interest in incorporating inference capabilities into sensor-rich embedded platforms such as autonomous vehicles, wearables, and others. A central problem in the design of such systems is the need to extract information…
Quantifying the temperature of microdevices is critical for probing nanoscale energy transport.Such quantification is often accomplished by integrating resistance thermometers into microdevices. However, such thermometers frequently become…
Measuring and analyzing the performance of software has reached a high complexity, caused by more advanced processor designs and the intricate interaction between user programs, the operating system, and the processor's microarchitecture.…
The AI datacenters are currently being deployed on a large scale to support the training and deployment of power-intensive large-language models (LLMs). Extensive amount of computation and cooling required in datacenters increase concerns…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
Measuring thermodynamic quantities can be easy or not, depending on the system that is being studied. For a macroscopic object, measuring temperatures can be as simple as measuring how much a column of mercury rises when in contact with the…
The precise measurement of temperature is crucial in various fields such as biology, medicine, industrial automation, energy management, and daily life applications. While in most scenarios, sensors with a fixed thermal conductivity…
In this paper we present a simple and efficient built-in temperature sensor for thermal monitoring of standard-cell based VLSI circuits. The proposed smart temperature sensor uses a ring-oscillator composed of complex gates instead of…
Emulating thermal observables on a digital quantum computer is essential for quantum simulation of many-body physics. However, thermalization typically requires a large system size due to incorporating a thermal bath, whilst limited…
This paper demonstrates the use of voltage noise thermometry, with a cross-correlation technique, as a dissipation-free method of thermometry inside a CMOS integrated circuit (IC). We show that this technique exhibits broad agreement with…
Graphics Processing Units (GPUs) support dynamic voltage and frequency scaling (DVFS) in order to balance computational performance and energy consumption. However, there still lacks simple and accurate performance estimation of a given GPU…