与 RD53A 读出 ASIC 互连的质子辐照 3D 像素传感器测试结果
仪器与探测器
2019-09-02 v2
摘要
本文报道了与 RD53A 原型读出 ASIC 凸点键合的 3D 像素传感器的束流测试结果。来自 FBK（意大利）和 IMB-CNM（西班牙）的传感器在质子辐照前和辐照后均进行了测试，等效注量约为 cm（1 MeV 等效中子）。这是首次将单收集电极细间距 3D 传感器辐照至如此注量并与细间距 ASIC 凸点键合。对所采集数据的初步分析表明，经过高能质子辐照后，被测传感器的击中探测效率未出现退化，证明了 3D 像素传感器优异的辐射耐受性。因此，它们将成为 HL-LHC 实验最内层极端辐射环境的优秀候选者。
引用
@article{arxiv.1903.12531,
title = {Results on Proton-Irradiated 3D Pixel Sensors Interconnected to RD53A Readout ASIC},
author = {Jordi Duarte-Campderros and Esteban Curras and Marcos Fernandez and Gervasio Gomez and Andrea Garcia and Javier Gonzalez and Esther Silva and Ivan Vila and Richard Jaramillo and Marco Meschini and Rudy Ceccarelli and Mauro Dinardo and Simone Gennai and Luigi Moroni and Davide Zuolo and Natale Demaria and Ennio Monteil and Luigi Gaioni and Alberto Messineo and Gian-Franco Dalla Beta and Roberto Menicino and Maurizio Boscardin},
journal= {arXiv preprint arXiv:1903.12531},
year = {2019}
}
备注
Conference Proceedings of VCI2019, 15th Vienna Conference of Instrumentation, February 18-22, 2019, Vienna, Austria. arXiv admin note: text overlap with arXiv:1903.01963