Related papers: Thermal-Aware Floorplanner for 3D IC, including TS…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
Thermal management of integrated circuits (ICs) is important to prevent thermal hotspots which are the leading cause of IC failure. Thermal management is even more critical in 3D integrated circuits (3D ICs) as the prevalence of thermal…
During the earliest phase of architectural design process, practitioners after analyzing the client's design program, legal requirements, topographic constraints, and preferences synthesize these requirements into architectural floor plan…
This work summarizes recent progress on the thermal transport properties of three-dimensional (3D) nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or…
Multi-modal scene reconstruction integrating RGB and thermal infrared data is essential for robust environmental perception across diverse lighting and weather conditions. However, extending 3D Gaussian Splatting (3DGS) to multi-spectral…
With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…
To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However, previous tools struggle to handle the unique heterogeneous…
The continuous increase in computational power of GPUs, essential for advancements in areas like artificial intelligence and data processing, is driving the adoption of liquid cooling in data centers. Skived copper cold plates featuring…
Thermal comfort in shared spaces is essential to occupants well-being and necessary in the management of energy consumption. Existing thermal control systems for indoor shared spaces adjust temperature set points mechanically, making it…
Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe…
Thermal metamaterial represents a groundbreaking approach to control heat conduction, and, as a crucial component, thermal invisibility is of utmost importance for heat management. Despite the flourishing development of thermal invisibility…
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…
The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this project are to produce and demonstrate the efficiency of the…
In heterogeneous integration, different dies may employ distinct technologies, making floorplanning across multiple dies inherently coupled with technology assignment. By assuming a fixed technology, almost all prior floorplanning studies…
Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simulation, and dismiss the complex nonlinear thermal effects,…
In this paper we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of Smart Power Mosfets, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power…
Thermal-aware workload distribution is a common approach in the literature for power consumption optimization in data centers. However, data centers also have other operational costs such as the cost of equipment maintenance and…
Inverse problems associated with designing cylindrical thermal cloaking shells are studied. Using the optimization method these inverse problems are reduced to corresponding control problems in which the diagonal components of diagonal in…