Related papers: Thermal-Aware Floorplanner for 3D IC, including TS…

With the increasing power density of electronics components, the heat dissipation capacity of heat sinks gradually becomes a bottleneck. Many structural optimization methods, including topology optimization, have been widely used for heat…

Floorplanning determines the coordinate and shape of each module in Integrated Circuits. With the scaling of technology nodes, in floorplanning stage especially 3D scenarios with multiple stacked layers, it has become increasingly…

As people spend up to 87% of their time indoors, intelligent Heating, Ventilation, and Air Conditioning (HVAC) systems in buildings are essential for maintaining occupant comfort and reducing energy consumption. These HVAC systems in smart…

High power density systems require efficient cooling to maintain their thermal performance. Despite this, as systems get larger and more complex, human practice and insight may not suffice to determine the desired thermal management system…

Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…

In this work we have proposed a geometric model that is employed to devise a scheme for identifying the hotspots and zones in a chip. These spots or zone need to be guarded thermally to ensure performance and reliability of the chip. The…

The rapid growth of electronics has accelerated the adoption of 2.5D integrated circuits, where effective automated chiplet placement is essential as systems scale to larger and more heterogeneous chiplet assemblies. Existing placement…

Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…

To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…

Three-dimensional integrated circuit (3D IC) pack-aging and heterogeneous integration have emerged as central pillars of contemporary semiconductor scaling. Yet, the multi-physics coupling inherent to stacked architectures manifesting as…

Building operations represent a significant percentage of the total primary energy consumed in most countries due to the proliferation of Heating, Ventilation and Air-Conditioning (HVAC) installations in response to the growing demand for…

Self-assembled nano and micro-structures, particularly those capable of responsive erasure and regeneration, have garnered significant interest for their applications in smart photonics and electronics. However, current techniques for…

Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…

The past decade has seen the advent of numerous building energy efficiency visualization and simulation systems; however, most of them rely on theoretical thermal models to suggest building structural design for new constructions and…

The environmental impact of Large Language Models (LLMs) on data centers hosting these models is becoming a significant concern. While many efforts have focused on reducing the substantial training overhead of LLMs, carbon and water…

We present a B\'ezier-based Multi-Fidelity Thermal Optimization Framework, which is a computationally efficient methodology for the global optimization of 3D heat sinks. The flexible B\'ezier-parameterized fin geometries and the adopted…

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…

Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…

Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based…

Nowadays three dimension (3D) architectural visualisation has become a powerful tool in the conceptualisation, design and presentation of architectural products in the construction industry, providing realistic interaction and walkthrough…