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With technology scaling, the size of cache systems in chip-multiprocessors (CMPs) has been dramatically increased to efficiently store and manipulate a large amount of data in future applications and decrease the gap between cores and…
A large number of sensors deployed in recent years in various setups and their data is readily available in dedicated databases or in the cloud. Of particular interest is real-time data processing and 3D visualization in web-based user…
Reliability management is one of the primary concerns in manycore systems design. Different aging mechanisms such as Negative-Bias Temperature Instability (NBTI), Electromigration (EM), and thermal cycling can reduce the reliability of…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
Modern package designs make use of technologies such as backside power delivery (BSPD) and 3D stacked chiplets that require accounting for the heterogeneity in back end of the line (BEOL) structures in hot-spot prediction. Multiscale…
Thermoelectric devices convert temperature gradients into electrical power and vice versa, thus enabling energy scavenging from waste heat, sensing and cooling. Yet, many of these attractive applications are hindered by the limited…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
Renovating existing buildings is essential for climate impact. Early-phase renovation planning requires simulations based on thermal 3D models at Level of Detail (LoD) 3, which include features like windows. However, scalable and accurate…
Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…
The adoption of machine learning-based techniques for analog integrated circuit layout, unlike its digital counterpart, has been limited by the stringent requirements imposed by electric and problem-specific constraints, along with the…
Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integration. As chiplet counts grow, traditional placement tools,…
Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing…
Thermal-Aware Scheduling (TAS) provides methods to manage the thermal dissipation of a computing chip during task execution. These methods aim to avoid issues such as accelerated aging of the device, premature failure and degraded chip…
Major challenges of micro thermal machines are the thermal insulation and mechanical tolerance in the case of sliding piston. Switching from piston to membrane in microengines can alleviate the latest and lead to planar architectures.…
A building design aiding tool for space allocation and thermal performance optimization is being developed to help practitioners during the building space planning phase, predicting how it will behave regarding energy consumption and…
Efficient task partitioning plays a crucial role in achieving high performance at multiprocessor plat forms. This paper addresses the problem of energy-aware static partitioning of periodic real-time tasks on heterogeneous multiprocessor…
3D-stacked High Bandwidth Memory (HBM) architectures provide high-performance memory interactions to address the well-known performance challenge, namely the memory wall. However, these architectures are susceptible to thermal…
A thorough regulation of building energy systems translates in relevant energy savings and in a better comfort for the occupants. Algorithms to predict the thermal state of a building on a certain time horizon with a good confidence are…
The need to develop systems that exploit multi and many-core architectures to reduce wasteful heat generation is of utmost importance in compute-intensive applications. We propose an energy-conscious approach to multicore scheduling known…
Although 3D IC technology can provide very high integration density, they suffer from having hotspots that may reach thousands of degrees. To manage this heat, it is necessary to study the dynamics of cooling and thermal behavior of the…