Related papers: Thermal-Aware Floorplanner for 3D IC, including TS…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
The increasing transistor scale integration poses, among others, the thermal-aware floorplanning problem; consisting of how to place the hardware components in order to reduce overheating by dissipation. Due to the huge amount of feasible…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling algorithm for embedded systems. The algorithm is used as a…
Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…
The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Vision processing on traditional architectures is inefficient due to energy-expensive off-chip data movement. Many researchers advocate pushing processing close to the sensor to substantially reduce data movement. However, continuous…
The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize design iterations and unexpected challenges. Emphasizing the pre-register-transfer…
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…
Analyzing data centers with thermal-aware optimization techniques is a viable approach to reduce energy consumption of data centers. By taking into account thermal consequences of job placements among the servers of a data center, it is…
The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…