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A novel approach for creating tool paths for continuous carbon fiber-reinforced thermoplastic 3D printing is introduced. The aim is to enable load-bearing connections while avoiding non-manufacturable crossings of paths by generating layer…
This paper presents a novel algorithm that utilizes a 2D floorplan to align panorama RGBD scans. While effective panorama RGBD alignment techniques exist, such a system requires extremely dense RGBD image sampling. Our approach can…
Thermal management of power electronics and Electronic Control Units is crucial in times of increasing power densities and limited assembly space. Electric and autonomous vehicles are a prominent application field. Thermal Interface…
The ever increasing adoption of mobile devices with limited energy storage capacity, on the one hand, and more awareness of the environmental impact of massive data centres and server pools, on the other hand, have both led to an increased…
Accurate knowledge of temperatures in power semiconductor modules is crucial for proper thermal management of such devices. Precise prediction of temperatures allows to operate the system at the physical limit of the device avoiding…
Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven…
This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…
We propose an optimal operation control strategy for an electro-thermal microgrid. Compared to existing work, our approach increases flexibility by operating the thermal network with variable flow temperatures and in that way explicitly…
Floorplanning determines the shapes and locations of modules on a chip canvas and plays a critical role in optimizing the chip's Power, Performance, and Area (PPA) metrics. However, existing floorplanning approaches often fail to integrate…
Development of refrigerators based on Thermoacoustic technology is a novel solution to the present day need of cooling without causing environmental hazards. With added advantages of absence of moving parts and circulating refrigerants,…
Data-driven thermal predictors for 3D-ICs are often trained from scratch for each chip design using many high-fidelity finite-element simulations, leading to high data-generation cost and costly cross-design reuse. We propose Therm-FM, a…
The human skin exhibits remarkable capability to perceive contact forces and environmental temperatures, providing intricate information essential for nuanced manipulation. Despite recent advancements in soft tactile sensors, a significant…
In this paper, we develop an optimization-based systematic approach for the challenging, less studied, and important problem of optimal partitioning of multi-thermal zone buildings for the decentralized control. The proposed method consists…
Indoor heating during winters accounts for a significant portion of energy consumed by buildings in regions of cold climate. Development of transparent coatings for windows that efficiently harvest solar energy can play a major role in…
In this paper, we investigate the problem of minimizing the sum of energy cost and thermal discomfort cost in a long-term time horizon for a sustainable smart home with a Heating, Ventilation, and Air Conditioning (HVAC) load. Specifically,…
The precise measurement of temperature is crucial in various fields such as biology, medicine, industrial automation, energy management, and daily life applications. While in most scenarios, sensors with a fixed thermal conductivity…
Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…
We present a new technique of VLSI chip-level thermal analysis. We extend a newly developed method of solving two dimensional Laplace equations to thermal analysis of four adjacent materials on a mother board. We implement our technique in…
The 4th generation of district heating systems face a potential problem where lowered water temperatures lead to higher flow rates, which requires higher hydraulic capacity in terms of pipe and pump sizes. This increases the effect of the…
This paper deals with a 3D visualization technique proposed to analyze and manage energy efficiency from a data center. Data are extracted from sensors located in the IBM Green Data Center in Montpellier France. These sensors measure…