A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

H. Chen; L. Hsu; X. Wei

A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

General Physics 2008-01-08 v1

Authors: H. Chen , L. Hsu , X. Wei

Abstract

This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability.

Keywords

vlsi technology thermoelectric cooling high-density devices semiconductor wafer solid-state cooling monolithic process

Cite

@article{arxiv.0801.0997,
  title  = {A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices},
  author = {H. Chen and L. Hsu and X. Wei},
  journal= {arXiv preprint arXiv:0801.0997},
  year   = {2008}
}

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Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

Abstract

Keywords

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