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Tasa: Thermal-aware 3D-Stacked Architecture Design with Bandwidth Sharing for LLM Inference

Hardware Architecture 2025-11-20 v3

Abstract

The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which vertically stacked multi DRAM dies on top of logic die. However, our experiments also show the 3D-stacked architecture faces severer thermal issues compared to 2D architecture, in terms of thermal temperature, gradient and scalability. To better exploit the potential of 3D-stacked architecture, we present Tasa, a heterogeneous architecture with cross-stack thermal optimizations to balance the temperature distribution and maximize the performance under the thermal constraints. High-performance core is designed for compute-intensive operations, while high-efficiency core is used for memory-intensive operators, e.g. attention layers. Furthermore, we propose a bandwidth sharing scheduling to improve the bandwidth utilization in such heterogeneous architecture. Extensive thermal experiments show that our Tasa architecture demonstrates greater scalability compared with the homogeneous 3D-stacked architecture, i.e. up to 5.55 \tccentigrade\tccentigrade, 9.37 \tccentigrade\tccentigrade, and 7.91 \tccentigrade\tccentigrade peak temperature reduction for 48, 60, and 72 core configurations. Our experimental for Llama-65B and GPT-3 66B inferences also demonstrate 2.85x and 2.21x speedup are obtained over the GPU baselines and state-of-the-art heterogeneous PIM-based LLM accelerator

Keywords

Cite

@article{arxiv.2508.07252,
  title  = {Tasa: Thermal-aware 3D-Stacked Architecture Design with Bandwidth Sharing for LLM Inference},
  author = {Siyuan He and Peiran Yan and Yandong He and Youwei Zhuo and Tianyu Jia},
  journal= {arXiv preprint arXiv:2508.07252},
  year   = {2025}
}