Related papers: Thermal-Aware Floorplanner for 3D IC, including TS…
This paper presents a unified optimization framework for phase change material (PCM) based cooling systems. Thermal management is critical in applications such as photovoltaic (PV) modules, battery packs, and power electronics, where…
Thermal density and hot spots limit three-dimensional (3D) implementation of massively-parallel SIMD processors and prohibit stacking DRAM dies above them. This study proposes replacing SIMD by an Associative Processor (AP). AP exhibits…
In this paper we study the thermal effective behaviour for 3D multiphase composite material consisting of three isotropic phases which are the matrix, the inclusions and the coating media. For this purpose we use an accelerated FFT-based…
Energy requirements for heating and cooling of buildings constitute a major fraction of end use energy consumed. Therefore, it is important to provide the occupant comfort requirements in buildings in an energy efficient manner. However,…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
In small satellites there is less room for heat control equipment, scientific instruments, and electronic components. Furthermore, the near proximity of electronic components makes power dissipation difficult, with the risk of not being…
In complex environments, autonomous robot navigation and environmental perception pose higher requirements for SLAM technology. This paper presents a novel method for semantically enhancing 3D point cloud maps with thermal information. By…
For a system-level design of Networks-on-Chip for 3D heterogeneous System-on-Chip (SoC), the locations of components, routers and vertical links are determined from an application model and technology parameters. In conventional methods,…
Accurately measuring the thermal properties of buried interfaces is crucial for understanding heat transport in multilayered materials, particularly in applications such as batteries and integrated circuits. The conventional 3$\omega$…
Heat management is crucial for state-of-the-art applications such as passive radiative cooling, thermally adjustable wearables, and camouflage systems. Their adaptive versions, to cater to varied requirements, lean on the potential of…
Control over surface temperature is of paramount importance in optoelectronics, photocatalysis and biosensing applications, among others. Thermoplasmonic approaches have demonstrated unrivalled performance for controlling surface…
Accurately predicting nonlinear transient thermal fields in two-dimensional domains is a significant challenge in various engineering fields, where conventional analytical and numerical methods struggle to balance physical fidelity with…
The electrification of powertrains is rising as the objective for a more viable future is intensified. To ensure continuous and reliable operation without undesirable malfunctions, it is essential to monitor the internal temperatures of…
Thermal Interface Materials (TIMs) are widely used in electronic packaging. Increasing power density and limited assembly space pose high demands on thermal management. Large cooling surfaces need to be covered efficiently. When joining the…
Optimal multi-layer device design requires consideration of fabrication uncertainties associated with inter-layer alignment and conformal layering. We present layer-restricted topology optimization (TO), a novel technique which mitigates…
In this paper, we describe a mathematical model and a numerical simulation method for the condenser component of a novel two-phase thermosyphon cooling system for power electronics applications. The condenser consists of a set of…
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of…