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This paper describes the design and characteristics of monolithically integrated three-terminal gated III-Nitride light emitting diodes (LEDs) devices. The impact of channel doping and thickness on the voltage penalty of the transistor-LED…
The present work experimentally demonstrates the fabrication of CVD grown monolayer MoS2 ultra thin quantum well based double barrier resonant tunneling device (RTD) architecture well compatible with conventional CMOS fabrication…
The Last Level Cache (LLC) is the processor's critical bridge between on-chip and off-chip memory levels - optimized for high density, high bandwidth, and low operation energy. To date, high-density (HD) SRAM has been the conventional…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Network-on-chip (NoC) architectures have been proposed as a promising alternative to classical bus-based communication architectures. In this paper, we propose a two phases framework to solve application-specific NoCs topology generation…
The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…
Power Delivery Networks (PDNs) are critical for maintaining voltage integrity in modern multiprocessor systems. Conventional early-stage PDN planning relies on static or worst-case power assumptions, often leading to over-provisioned…
A NoC is composed by IP cores (Intellectual Propriety) and switches connected among themselves by communication channels. End-to-End Delay (EED) communication is accomplished by the exchange of data among IP cores. Often, the structure of…
It is well-known that cross-layer scheduling which adapts power, rate and user allocation can achieve significant gain on system capacity. However, conventional cross-layer designs all require channel state information at the base station…
Two-dimensional materials (2DM) and their derived heterostructures have electrical and optical properties that are widely tunable via several approaches, most notably electrostatic gating and interfacial engineering such as twisting. While…
Research studies have demonstrated the feasibility and advantages of Network-on-Chip (NoC) over traditional bus-based architectures but have not focused on compatibility communication standards. This paper describes a number of issues faced…
The 2D/3D construction of hybrid perovskite interfaces is gaining increasing attention due to their enhanced stability towards degradation without compromising the corresponding solar cell efficiency. Much of it is due to the interfacial…
Three-dimensional (3D) topological Dirac semimetal, when thinned down to 2D few layers, is expected to possess gapped Dirac nodes via quantum confinement effect and concomitantly display the intriguing quantum spin Hall (QSH) insulator…
The Von Neumann bottleneck, which relates to the energy cost of moving data from memory to on-chip core and vice versa, is a serious challenge in state-of-the-art AI architectures, like Convolutional Neural Networks' (CNNs) accelerators.…
Reliability management is one of the primary concerns in manycore systems design. Different aging mechanisms such as Negative-Bias Temperature Instability (NBTI), Electromigration (EM), and thermal cycling can reduce the reliability of…
In contrast to monolithic devices, modular, networked quantum architectures are based on interconnecting smaller quantum hardware nodes using quantum communication links, and offer a promising approach to scalability. Virtual distillation…
The ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates make \b{eta}-Ga2O3 promising for applications of next-generation power electronics while its thermal conductivity is at least one order of magnitude…
Nanofluids are known to have significantly different thermal properties relative to the corresponding conventional fluids. Heat transfer at the solid-fluid interface affects the thermal properties of nanofluids. The current work helps in…
Convolutional Neural Networks (CNNs) have been regarded as the go-to models for visual recognition. More recently, convolution-free networks, based on multi-head self-attention (MSA) or multi-layer perceptrons (MLPs), become more and more…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…