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Carbon nanotube field-effect transistors (CNFET) emerge as a promising alternative to CMOS transistors for the much higher speed and energy efficiency, which makes the technology particularly suitable for building the energy-hungry last…
Today, there are a plethora of In-Memory Computing (IMC) devices- SRAMs, PCMs & FeFETs, that emulate convolutions on crossbar-arrays with high throughput. Each IMC device offers its own pros & cons during inference of Deep Neural Networks…
Fault tolerance in multi-core architecture has attracted attention of research community for the past 20 years. Rapid improvements in the CMOS technology resulted in exponential growth of transistor density. It resulted in increased…
3D additive manufacturing enables the fabrication of nanophotonic structures with subwavelength features that control light across macroscopic scales. Gradient-based optimization offers an efficient approach to design these complex and…
With the global energy transition and rapid development of renewable energy, the scheduling optimization challenge for combined power-heat systems under new energy integration and multiple uncertainties has become increasingly prominent.…
The Cray T3D, an MIMD system with NUMA shared memory capabilities and in principle very low communications latency, can support the Canopy framework for grid-oriented applications. CANOPY has been ported to the T3D, with the intent of…
Rapidly increasing interest in low-dimensional materials is driven by the emerging requirement to develop nanoscale solid-state devices with novel functional properties that are not available in three-dimensional bulk phases. Among the…
Network-on-Chip (NoC) enables energy-efficient communication between numerous components in System-on-Chip architectures. The optical NoC is widely considered a key technology to overcome the bandwidth and energy limitations of traditional…
The rapid growth of multi-core systems highlights the need for efficient Network-on-Chip (NoC) design to ensure seamless communication. Cache coherence, essential for data consistency, substantially reduces task computation time by enabling…
To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However, previous tools struggle to handle the unique heterogeneous…
Transfer techniques based on two dimensional (2D) materials and devices offer immense potential towards their industrial integration with the existing silicon based electronics. To achieve high quality devices, there is an urgent…
With the increasing power density of electronics components, the heat dissipation capacity of heat sinks gradually becomes a bottleneck. Many structural optimization methods, including topology optimization, have been widely used for heat…
With the increasing digital services demand, performance and power-efficiency become vital requirements for digital circuits and systems. However, the enabling CMOS technology scaling has been facing significant challenges of device…
3D DRAM has emerged as a promising approach for continued density scaling, but its viability is limited by routing and hybrid bonding constraints to periphery, which may degrade sensing margin, latency, and array efficiency. With device…
Analog-to-digital converters (ADCs) are a major contributor to the power consumption of multiple-input multiple-output (MIMO) communication systems with large number of antennas. Use of low resolution ADCs has been proposed as a means to…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
Precisely localizing 3D objects from a single image constitutes a central challenge in monocular 3D detection. While DETR-like architectures offer a powerful paradigm, their direct application in this domain encounters inherent limitations,…
Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing…
Extrusion based 3D Printing (E3DP) is an Additive Manufacturing (AM) technique that extrudes thermoplastic polymer in order to build up components using a layerwise approach. Hereby, AM typically requires long production times in comparison…
The rise of delay-sensitive yet computing-intensive Internet of Things (IoT) applications poses challenges due to the limited processing power of IoT devices. Mobile Edge Computing (MEC) offers a promising solution to address these…