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Winograd convolution is originally proposed to reduce the computing overhead by converting multiplication in neural network (NN) with addition via linear transformation. Other than the computing efficiency, we observe its great potential in…
Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
Real-time monocular 3D object detection remains challenging due to severe depth ambiguity, viewpoint shifts, and the high computational cost of 3D reasoning. Existing approaches either rely on LiDAR or geometric priors to compensate for…
The past few decades have seen exponential growth in capabilities of digital electronics primarily due to the ability to scale Integrated Circuits (ICs) to smaller dimensions while attaining power and performance benefits. That scalability…
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…
The prediction of upcoming events in industrial processes has been a long-standing research goal since it enables optimization of manufacturing parameters, planning of equipment maintenance and more importantly prediction and eventually…
In this paper, we have experimentally demonstrated, for the first time, III-V 4D transistors with vertically stacked InGaAs nanowire (NW) channels and gate-all-around (GAA) architecture. Novel process technology enabling the transition from…
Traditionally, the output noise and power supply rejection of low-dropout regulators (LDOs) are optimized to minimize power supply fluctuations, reducing their impact on the low-frequency noise of target voltage-controlled oscillators…
The growing trends of data centers over last decades including social networking, cloud-based applications and storage technologies enabled many advances to take place in the networking area. Recent changes imply continuous demand for…
Massive MIMO systems have the potential to significantly enhance spectral efficiency, yet their widespread integration is hindered by the high power consumption of the underlying computations. This paper explores the applicability and…
Additive manufacturing has been recognized as an industrial technological revolution for manufacturing, which allows fabrication of materials with complex three-dimensional (3D) structures directly from computer-aided design models. The…
A surge in artificial intelligence and autonomous technologies have increased the demand toward enhanced edge-processing capabilities. Computational complexity and size of state-of-the-art Deep Neural Networks (DNNs) are rising…
Photonic computing shows promise for transformative advancements in machine learning (ML) acceleration, offering ultra-fast speed, massive parallelism, and high energy efficiency. However, current photonic tensor core (PTC) designs based on…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
Diffusion models have shown exceptional performance in visual generation tasks. Recently, these models have shifted from traditional U-Shaped CNN-Attention hybrid structures to fully transformer-based isotropic architectures. While these…
The demands of modern electronic components require advanced computing platforms for efficient information processing to realize in-memory operations with a high density of data storage capabilities towards developing alternatives to von…
The design of the buffer manager in database management systems (DBMSs) is influenced by the performance characteristics of volatile memory (DRAM) and non-volatile storage (e.g., SSD). The key design assumptions have been that the data must…
The success of DNNs and their high computational requirements pushed for large codesign efforts aiming at DNN acceleration. Since DNNs can be represented as static computational graphs, static memory allocation and tiling are two crucial…
As mobile systems become more advanced, the security of System-on-Chips (SoCs) is increasingly threatened by thermal attacks. This research introduces a new attack method called the Multi-stage Adaptive Thermal Trojan for Efficiency and…
Monocular 3D detection relies on just a single camera and is therefore easy to deploy. Yet, achieving reliable 3D understanding from monocular images requires substantial annotation, and 3D labels are especially costly. To maximize…