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SiC is a robust semiconductor material considered ideal for high-power application due to its material stability and large bulk thermal conductivity defined by the very fast phonons. In this paper, however, we show that both…

材料科学 · 物理学 2007-05-23 Eleni Ziambaras , Per Hyldgaard

Varying the thermal boundary conductance at metal-dielectric interfaces is of great importance for highly integrated electronic structures such as electronic, thermoelectric and plasmonic devices where heat dissipation is dominated by…

应用物理 · 物理学 2020-12-08 S. M. Oommen , S. Pisana

During the fabrication of heterogeneous structures inside chips, impurities and defects are inevitably introduced. However, the mechanism by which defects affect interfacial heat transport remains unclear. In this work, a microscale thermal…

材料科学 · 物理学 2025-08-19 Ershuai Yin , Wenzhu Luo , Lei Wang , Qiang Li

Recent experiments have indicated that employing nanostructures can enhance interfacial heat transport, but the mechanism by which different structural morphologies and dimensions contribute to the full-spectrum phonon interfacial transport…

流体动力学 · 物理学 2024-06-28 Wenzhu Luo , Neng Wang , Wenlei Lian , Ershuai Yin , Qiang Li

We study the thermal conductance across solid-solid interfaces as the composition of an intermediate matching layer is varied. In absence of phonon-phonon interactions, an added layer can make the interfacial conductance increase or…

介观与纳米尺度物理 · 物理学 2017-05-10 Carlos A. Polanco , Rouzbeh Rastgarkafshgarkolaei , Jingjie Zhang , Nam Le , Pamela M. Norris , Avik W. Ghosh

Heat transfer at the interface between two materials is becoming increasingly important as the size of electronic devices shrinks. Most studies concentrate on the interfacial thermal conductance between either crystalline-crystalline or…

介观与纳米尺度物理 · 物理学 2024-09-09 Julien El Hajj , Christophe Adessi , Michaël de San Feliciano , Gilles Ledoux , Samy Merabia

Understanding the ideal limit of interfacial thermal conductance (ITC) across semiconductor heterointerfaces is crucial for optimizing heat dissipation in practical applications. By employing a highly accurate and efficient machine-learned…

材料科学 · 物理学 2025-04-28 Xiaonan Wang , Xin Wu , Penghua Ying , Zheyong Fan , Huarui Sun

We demonstrate optimization of thermal conductance across nanostructures by developing a method combining atomistic Green's function and Bayesian optimization. With an aim to minimize and maximize the interfacial thermal conductance (ITC)…

材料科学 · 物理学 2017-05-24 Shenghong Ju , Takuma Shiga , Lei Feng , Zhufeng Hou , Koji Tsuda , Junichiro Shiomi

This study investigates thermal transport across nanocrystalline diamond/AlGaN interfaces, crucial for enhancing thermal management in AlGaN/AlGaN-based devices. Chemical vapor deposition growth of diamond directly on AlGaN resulted in a…

Silicon carbide (SiC) is a wide band gap semiconductor with a variety of industrial applications. Among its many useful properties is its high thermal conductivity, which makes it advantageous for thermal management applications. In this…

We report finite-volume simulations of the phonon Boltzmann transport equation (BTE) for heat conduction across the heterogeneous interfaces in SiGe superlattices. The diffuse mismatch model incorporating phonon dispersion and polarization…

介观与纳米尺度物理 · 物理学 2010-05-17 Dhruv Singh , Jayathi Y. Murthy , Timothy S. Fisher

An increasing number of two-dimensional (2D) materials have already been achieved experimentally or predicted theoretically, which have potential applications in nano- and opto-electronics. Various applications for electronic devices are…

材料科学 · 物理学 2018-10-17 San-Dong Guo , Jiang-Tao Liu

The mechanism of heat transfer and the contribution of electron-phonon coupling to thermal conductance of a metal-semiconductor interface remains unclear in the present literature. We report ab initio simulations of a technologically…

材料科学 · 物理学 2015-04-07 Sridhar Sadasivam , Umesh V. Waghmare , Timothy S. Fisher

Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandgap electronics. Advanced heterogeneous integration not only…

A comprehensive rational thermal material design paradigm requires the ability to reduce and enhance the thermal conductivities of nanomaterials. In contrast to the existing ability to reduce the thermal conductivity, methods that allow to…

介观与纳米尺度物理 · 物理学 2017-10-09 Abhinav Malhotra , Kartik Kothari , Martin Maldovan

We develop an accurate interlayer pairwise potential derived from the \textit{ab-initio} calculations and investigate the thermal transport of silicene bilayers within the framework of equilibrium molecular dynamics simulations. The…

Metal-semiconductor interfaces play a central role in micro and nano-electronic devices as heat dissipation or temperature drop across these interfaces can significantly affect device performance. Prediction of accurate thermal boundary…

We determine the size effect on the lattice thermal conductivity of nanoscale wire and multilayer structures formed in and by some typical semiconductor materials, using the Boltzmann transport equation and focusing on the Knudsen flow…

材料科学 · 物理学 2009-11-11 Eleni Ziambaras , Per Hyldgaard

Interface phonon modes that are generated by several atomic layers at the heterointerface play a major role in the interface thermal conductance for nanoscale high-power devices such as nitride-based high-electron-mobility transistors and…

Features of thermal transport in multilayered porous silicon nanostructures are considered. Such nanostructures were fabricated by electrochemical etching of monocrystalline Si substrates by applying periodically changed current density.…

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