相关论文: Stack up your chips: Betting on 3D integration to …

For decades, Moore's Law has served as a steadfast pillar in computer architecture and system design, promoting a clear abstraction between hardware and software. This traditional Moore's computing paradigm has deepened the rift between the…

Monolithic three-dimensional integration of memory and logic circuits could dramatically improve performance and energy efficiency of computing systems. Some conventional and emerging memories are suitable for vertical integration,…

Due to the wide diffusion of 3D printing technologies, geometric algorithms for Additive Manufacturing are being invented at an impressive speed. Each single step, in particular along the Process Planning pipeline, can now count on dozens…

Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…

Three-dimensional integrated circuits (3D ICs) have emerged as a promising solution to the scaling limits of two-dimensional designs, offering higher integration density, shorter interconnects, and improved performance. As design complexity…

Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…

With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in two-dimensional (2D)…

Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…

Two-dimensional materials can be combined by placing individual layers on top of each other, so that they are bound only by their van der Waals interaction. The sequence of layers can be chosen arbitrarily, enabling an essentially…

Spiking neural networks (SNNs) are powerful models of spatiotemporal computation and are well suited for deployment on resource-constrained edge devices and neuromorphic hardware due to their low power consumption. Leveraging attention…

Advances in hybrid bonding and packaging have driven growing interest in 3D DRAM-stacked accelerators with higher memory bandwidth and capacity. As LLMs scale to hundreds of billions or trillions of parameters, distributed inference across…

Over the years, the DRAM latency has not scaled proportionally with its density due to the cost-centric mindset of the DRAM industry. Prior work has shown that this shortcoming can be overcome by reducing the critical length of DRAM access…

As an important goal of high-performance computing, the concept of performance portability has been around for many years. As the failure of Moore's Law, it is no longer feasible to improve computer performance by simply increasing the…

With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the…

Additive manufacturing, or 3D printing, is a promising manufacturing technique marred by product deformation due to material solidification in the printing process. Control of printed product deformation can be achieved by a compensation…

Quantum computing is presently undergoing rapid development to achieve a significant speedup promised in certain applications. Nonetheless, scaling quantum computers remains a formidable engineering challenge, prompting exploration of…

Reliability has become an increasing concern in modern computing. Integrated circuits (ICs) are the backbone of modern computing devices across industries, including artificial intelligence (AI), consumer electronics, healthcare,…

Response time requirements for big data processing systems are shrinking. To meet this strict response time requirement, many big data systems store all or most of their data in main memory to reduce the access latency. Main memory…

Design of printed circuit board (PCB) stack-up requires the consideration of characteristic impedance, insertion loss and crosstalk. As there are many parameters in a PCB stack-up design, the optimization of these parameters needs to be…

The rapid growth of artificial intelligence, coupled with the slowing of Moore's law, is straining computing infrastructure, as CMOS electronics face inherent limits in bandwidth, energy efficiency, and parallelism. Integrated photonic…