相关论文: 3D Field Simulation Model for Bond Wire On-Chip In…
As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is…
We derive a lumped circuit model for inductive antenna spin-wave transducers in the vicinity of a ferromagnetic medium. The model considers the antenna's Ohmic resistance, its inductance, as well as the additional inductance due to the…
Data-driven thermal predictors for 3D-ICs are often trained from scratch for each chip design using many high-fidelity finite-element simulations, leading to high data-generation cost and costly cross-design reuse. We propose Therm-FM, a…
Methods for characterisation of 3D magnetic spin structures are necessary to advance the performance of 3D magnetic nanoscale technologies. However, as the component dimensions approach the nanometre range, it becomes more challenging to…
We report a full (3D) micromagnetic simulation of a set of 100 ferrite (Fe$_3$O$_4$) cylindrical dots, arranged in a 10 by 10 square (planar) array of side 3.27 $\mu$m, excited by an external in-plane magnetic field. The resulting power…
Isolators are commonly found in the amplification chain of microwave setups to shield sensitive devices such as superconducting qubits from noise and back-scattered signals. Conventional ferrite-based isolators are bulky, lossy and rely on…
We report on infrared (IR) spectro-microscopy of the electronic excitations in nanometer-thick accumulation layers in FET devices based on poly(3-hexylthiophene). IR data allows us to explore the charge injection landscape and uncovers the…
Vacuum-forming is a common manufacturing technique for constructing thin plastic shell products by pressing heated plastic sheets onto a mold using atmospheric pressure. Vacuum-forming is ubiquitous in packaging and casing products in…
The Hubbard model is one of the primary models for understanding the essential many-body physics in condensed matter systems such as Mott insulators and cuprate high-Tc superconductors. Recent advances in atomically precise fabrication in…
In this work we present a novel computational method for embedding arbitrary curved one-dimensional (1D) fibers into three-dimensional (3D) solid volumes, as e.g. in fiber-reinforced materials. The fibers are explicitly modeled with highly…
Two-dimensional (2D) materials are considered for numerous applications in microelectronics, although several challenges remain when integrating them into functional devices. Weak adhesion is one of them, caused by their chemical inertness.…
We present an elastic simulator for domains defined as evolving implicit functions, which is efficient, robust, and differentiable with respect to both shape and material. This simulator is motivated by applications in 3D reconstruction: it…
Most large engineering structures are described as assemblies of plates and shells and they are computed as such using adhoc Finite Element packages. In fact their computation in 3D would be much too costly. In this framework, the…
We argue that effective 1D models of stripes in the cuprate superconductors can be constructed by studying ground states and elementary excitations of domain walls in 2D model antiferromagnets. This method, applied to the t-J model with…
We present, SurfCuit, a novel approach to design and construction of electric circuits on the surface of 3D prints. Our surface mounting technique allows durable construction of circuits on the surface of 3D prints. SurfCuit does not…
To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…
For the purpose of withstanding very high radiation doses, silicon pixel sensors with a 3D electrode geometry are being developed. Detectors of this kind are highly interesting for harch radiation environments such as expected in the High…
Directional couplers are a fundamental building block in integrated photonics, particularly in quantum applications and optimization-based design where precision is critical. Accurate functionality is crucial to ensure reliable operation…
The embedded DRAM (eDRAM) is more and more used in System On Chip (SOC). The integration of the DRAM capacitor process into a logic process is challenging to get satisfactory yields. The specific process of DRAM capacitor and the low…
The field error due to magnetization of superconductors in a superconducting magnet can significantly compromise the field homogeneity which is extremely important for NMR magnets. This is especially true for high Tc superconducting…