相关论文: Demystifying the Characteristics of 3D-Stacked Mem…

Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for…

3D-stacked High Bandwidth Memory (HBM) architectures provide high-performance memory interactions to address the well-known performance challenge, namely the memory wall. However, these architectures are susceptible to thermal…

Over the last three decades, innovations in the memory subsystem were primarily targeted at overcoming the data movement bottleneck. In this paper, we focus on a specific market trend in memory technology: 3D-stacked memory and caches. We…

The implementation of Hyperdimensional Computing (HDC) on In-Memory Computing (IMC) architectures faces significant challenges due to the mismatch between highdimensional vectors and IMC array sizes, leading to inefficient memory…

With emerging storage-class memory (SCM) nearing commercialization, there is evidence that it will deliver the much-anticipated high density and access latencies within only a few factors of DRAM. Nevertheless, the latency-sensitive nature…

Memory latency, bandwidth, capacity, and energy increasingly limit performance. In this paper, we reconsider proposed system architectures that consist of huge (many-terabyte to petabyte scale) memories shared among large numbers of CPUs.…

Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…

With technology scaling, the size of cache systems in chip-multiprocessors (CMPs) has been dramatically increased to efficiently store and manipulate a large amount of data in future applications and decrease the gap between cores and…

Response time requirements for big data processing systems are shrinking. To meet this strict response time requirement, many big data systems store all or most of their data in main memory to reduce the access latency. Main memory…

The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…

3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…

The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…

Today's systems are overwhelmingly designed to move data to computation. This design choice goes directly against at least three key trends in systems that cause performance, scalability and energy bottlenecks: (1) data access from memory…

Thermal management of integrated circuits (ICs) is important to prevent thermal hotspots which are the leading cause of IC failure. Thermal management is even more critical in 3D integrated circuits (3D ICs) as the prevalence of thermal…

3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…

Brain-inspired hyperdimensional computing (HDC) is an emerging machine learning (ML) methods. It is based on large vectors of binary or bipolar symbols and a few simple mathematical operations. The promise of HDC is a highly efficient…

The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…

Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…

Hyperdimensional computing (HDC) is an emerging computing paradigm that represents, manipulates, and communicates data using very long random vectors (aka hypervectors). Among different hardware platforms capable of executing HDC…

Memory-centric computing aims to enable computation capability in and near all places where data is generated and stored. As such, it can greatly reduce the large negative performance and energy impact of data access and data movement, by…