相关论文: Selecting optimal parallel microchannel configurat…
A parallel and nested version of a frequency filtering preconditioner is proposed for linear systems corresponding to diffusion equation on a structured grid. The proposed preconditioner is found to be robust with respect to jumps in the…
The increase in dissipated power per unit area of electronic components sets higher demands on the performance of the heat sink. Also if we continue at our current rate of miniaturisation, laptops and other electronic devices can get heated…
Understanding nanoscale hotspot thermal transport is crucial in electronic devices. Contrary to common perception, recent experiments show that closely spaced nanoscale multiple hotspots can enhance heat dissipation. Here, the thermal…
The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms,…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
Cooling systems based on the caloric effects of ferroic materials show high potential for various cooling and heat-pumping applications due to their potentially high efficiencies and the lack of any environmentally hazardous refrigerants.…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Multiphase flow in parallel channels is often an efficient approach to manage heat and energy distribution in engineering systems. However, two-phase flow with heating in parallel channels is prone to maldistribution, resulting in…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
This work addresses the simulation of heat flow and electric currents in thin wires. An important application is the use of bond wires in microelectronic chip packaging. The heat distribution is modeled by an electrothermal coupled problem,…
Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…
We propose an optimal operation control strategy for an electro-thermal microgrid. Compared to existing work, our approach increases flexibility by operating the thermal network with variable flow temperatures and in that way explicitly…
Any architecture for practical quantum computing must be scalable. An attractive approach is to create multiple cores, computing regions of fixed size that are well-spaced but interlinked with communication channels. This exploded…
One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable…
Electrons in operating microelectronic semiconductor devices are accelerated by locally varying strong electric field to acquire effective electron temperatures nonuniformly distributing in nanoscales and largely exceeding the temperature…
Major chip manufacturers have all introduced Multithreaded processors. These processors are used for running a variety of workloads. Efficient resource utilization is an important design aspect in such processors. Depending on the workload,…
Designing efficient cooling systems for integrated circuits (ICs) relies on a deep understanding of the electro-thermal properties of transistors. To shed light on this issue in currently fabricated FinFETs, a quantum mechanical solver…
We use hydrodynamic simulations with adaptive grid refinement to study the dependence of hot gas flows in X-ray luminous giant elliptical galaxies on the efficiency of heat supply to the gas. We consider a number of potential heating…
Application migration and dynamic voltage and frequency scaling (DVFS) are indispensable means for fully exploiting the available potential in thermal optimization of a heterogeneous clustered multi-core processor under user-defined quality…
Networks of interconnected resistors, springs and beams, or pores are standard models of studying scalar and vector transport processes in heterogeneous materials and media, such as fluid flow in porous media, and conduction, deformations,…