相关论文: Smart packaging of electronics and integrated MEMS…
The development of advanced piezoelectric quartz MEMS for sensing and precise frequency control applications requires the nanostructuration and on chip integration on silicon of this material. However, the current quartz manufacturing…
Compounds of low lattice thermal conductivity (LTC) are essential for seeking thermoelectric materials with high conversion efficiency. Some strategies have been used to decrease LTC. However, such trials have yielded successes only within…
Conjugated polymer fibers can be used to manufacture various soft fibrous optoelectronic devices, significantly advancing wearable devices and smart textiles. Recently, conjugated polymer-based fibrous electronic devices have been widely…
With the versatile manipulation capability, programmable metasurfaces are rapidly advancing in their intelligence, integration, and commercialization levels. However, as the programmable metasurfaces scale up, their control configuration…
A huge interesting progress in the field of organic electronic materials and devices has been observed in the last decade. However, the understanding of these materials is still a challenge to overcome. Most studies in literature focus on…
Laser cooled atoms are central to modern precision measurements. They are also increasingly important as an enabling technology for experimental cavity quantum electrodynamics, quantum information processing and matter wave interferometry.…
Active microelectromechanical systems can couple the nanomechanical domain with the electronic domain by integrating electronic sensing and actuation mechanisms into the micromechanical device. This enables very fast and sensitive…
Stacked intelligent metasurface (SIM), which consists of multiple layers of intelligent metasurfaces, is emerging as a promising solution for future wireless communication systems. In this timely context, we focus on broadcast…
Laser cooled atoms have proven transformative for precision metrology, playing a pivotal role in state-of-the-art clocks and interferometers, and having the potential to provide a step-change in our modern technological capabilities. To…
Plasmons, collective excitations of electrons in solids, are associated with strongly confined electromagnetic fields, with wavelengths far below the wavelength of photons in free space. This strong confinement promises the realization of…
We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating…
This paper reports on formation of high aspect micro patterns on low temperature co-fired ceramic (LTCC) substrates by integrating micro inkjetting with electroless plating. Micro inkjetting was realized by using an inkjetting printer that…
Lab-on-a-chip (LOC) forms the basis of the new-generation portable analytical systems. LOC allows the manipulation of ultralow flows of liquid reagents and multistep reactions on a microfluidic chip, which requires a robust and precise…
Low-profile patterned plasmonic surfaces are synergized with a broad class of silicon microstructures to greatly enhance near-field nanoscale imaging, sensing, and energy harvesting coupled with far-field free-space detection. This concept…
Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the…
Nanophotonic engineering of light-matter interaction at subwavelength scale allows thermal radiation that is fundamentally different from that of traditional thermal emitters and provides exciting opportunities for various thermal-photonic…
For today's electronics manufacturing process, the emphasis on stable functionality, durability, and fixed physical forms is designed to ensure long-term usability. However, this focus on robustness and permanence complicates the…
The increasing demand for communication is degrading the electromagnetic (EM) transmission environment due to severe EM interference, significantly reducing the efficiency of the radio frequency (RF) spectrum. Metasurfaces, a promising…
Low emissivity (low-e) materials are crucial for conserving thermal energy in buildings, cold chain logistics and transportation by minimizing unwanted radiative heat loss or gain. However, their metallic nature intrinsically causes severe…
Due to their numerous advantages, communications over multicarrier schemes constitute an appealing approach for broadband wireless systems. Especially, the strong penetration of orthogonal frequency division multiplexing (OFDM) into the…