相关论文: Thermal analysis of 3D associative processor
Strongly interacting massive particle (SIMP) has become one of the promising dark matter (DM) candidates due to its capability of addressing the small-scale anomaly, where the final DM abundance is set via the freeze-out of $3\rightarrow 2$…
Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…
We study the performance and convergence properties of the Susceptibility Propagation (SusP) algorithm for solving the Inverse Ising problem. We first study how the temperature parameter (T) in a Sherrington-Kirkpatrick model generating the…
We present a novel hybrid incompressible flow/material point method solver for simulating the combustion of flammable solids. Our approach utilizes a sparse grid representation of solid materials in the material point method portion of the…
Today's scientific simulations require a significant reduction of data volume because of extremely large amounts of data they produce and the limited I/O bandwidth and storage space. Error-bounded lossy compression has been considered one…
The high dissipation of integrated circuits means serious problems for packaging and for the design of complex electronic systems. Another important area of research and development nowadays is the integration of sensors and micromechanical…
This paper discusses recent research that aims to enable computation close to data, an approach we broadly call processing-in-memory (PIM). PIM places computation mechanisms in or near where the data is stored (i.e., inside memory chips or…
In a previous work (Li et al. Science 364, 170) [1], we proposed a heat transfer system that preserves the anti-parity-time (APT) symmetry, and observe the rest-to-motion phase transition during the symmetry breaking. Recently, it was…
Parallel tempering, also known as replica exchange sampling, is an important method for simulating complex systems. In this algorithm simulations are conducted in parallel at a series of temperatures, and the key feature of the algorithm is…
Rapidly increasing traffic demand has forced indoor operators to deploy more and more Wi-Fi access points (APs). As AP density increases, inter-AP interference rises and may limit the capacity. Alternatively, cellular technologies using…
We propose SparsePipe, an efficient and asynchronous parallelism approach for handling 3D point clouds with multi-GPU training. SparsePipe is built to support 3D sparse data such as point clouds. It achieves this by adopting generalized…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…
Foundation models (FMs) such as CLIP and SAM have recently shown great promise in image segmentation tasks, yet their adaptation to 3D medical imaging-particularly for pathology detection and segmentation-remains underexplored. A critical…
A myriad of applications ranging from engineering and scientific simulations, image and signal processing as well as high-sensitive data retrieval demand high processing power reaching up to teraflops for their efficient execution. While a…
The polarizability operator plays a central role in density functional perturbation theory and other perturbative treatment of first principle electronic structure theories. The cost of computing the polarizability operator generally scales…
Parallel computing is a standard approach to achieving high-performance computing (HPC). Three commonly used methods to implement parallel computing include: 1) applying multithreading technology on single-core or multi-core CPUs; 2)…
Accurately predicting the temperature field in metal additive manufacturing (AM) processes is critical to preventing overheating, adjusting process parameters, and ensuring process stability. While physics-based computational models offer…
A theoretical memory with limited processing power and internal connectivity at each element is proposed. This memory carries out parallel processing within itself to solve generic array problems. The applicability of this in-memory…
Large language model (LLM) inference has been a prevalent demand in daily life and industries. The large tensor sizes and computing complexities in LLMs have brought challenges to memory, computing, and databus. This paper proposes a…
We present a simple experiment on thermal diffusion in metal rods that can be used to integrate computation into the advanced lab. An analytical solution exists for the transient heat conduction in an infinite rod with a delta function heat…