相关论文: Reliability Evaluation Method for Electronic Devic…
Software reliability analysis is performed at various stages during the process of engineering software as an attempt to evaluate if the software reliability requirements have been (or might be) met. In this report, I present a summary of…
Measuring testability early in the development life cycle especially at design phase is a criterion of crucial importance to software designers, developers, quality controllers and practitioners. However, most of the mechanism available for…
SRAM-based FPGAs are increasingly popular in the aerospace industry due to their field programmability and low cost. However, they suffer from cosmic radiation induced Single Event Upsets (SEUs). In safety-critical applications, the…
[Context and Motivation]: The quality of requirements specifications impacts subsequent, dependent software engineering activities. Requirements quality defects like ambiguous statements can result in incomplete or wrong features and even…
Traditional reliability analysis has been using time to event data, degradation data, and recurrent event data, while the associated covariates tend to be simple and constant over time. Over the past years, we have witnessed the rapid…
Changes are inherent in software development, often increasing developers' perception of instability. Understanding the relationship between human factors and Software Engineering processes is crucial to mitigating and preventing issues.…
A crucial challenge in engineering modern, integrated systems is to produce robust designs. Ensuring robust design is difficult because subsystem couplings produce unpredictable response to changes in whole system specifications. Here, we…
Software testing is aimed to improve the delivered reliability of the users. Delivered reliability is the reliability of using the software after it is delivered to the users. Usually the software consists of many modules. Thus, the…
The life time of electronic circuits board are impacted by the voids present in soldering balls. The quality inspection of solder balls by detecting and measuring the void is important to improve the board yield issues in electronic…
In this paper, a new reliability model has been developed for a single system degrading stochastically which experiences soft and hard failure. Soft failure occurs when the physical deterioration level of the system is greater than a…
The future Fifth Generation (5G) mobile cellular networks that are currently in research phase today enable broad range of services/applications beyond classical mobile communications. One key enabler for Ultra-Reliable services to be…
In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with…
Integrated circuits and electronic systems, as well as design technologies, are evolving at a great rate -- both quantitatively and qualitatively. Major developments include new interconnects and switching devices with atomic-scale…
Actually, software products are increasing in a fast way and are used in almost all activities of human life. Consequently measuring and evaluating the quality of a software product has become a critical task for many companies. Several…
Interface design can directly influence trustworthiness of a software. Thereby, it affects users' intention to use a tool. Previous research on user trust has not comprehensively addressed user interface design, though. We lack an…
For today's electronics manufacturing process, the emphasis on stable functionality, durability, and fixed physical forms is designed to ensure long-term usability. However, this focus on robustness and permanence complicates the…
The design of a system and its implementation are two tasks often carried out by different individuals on a development team, and can occur weeks or months apart. This creates a potential for divergence between real behavior and the…
Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid…
The reliability of the electric grid has in recent years become a larger concern for regulators, planners, and consumers due to several high-impact outage events, as well as the potential for even more impactful events in the future. These…
In this paper, the power response of power electronic loads in case of voltage drops are measured and their dynamics are analysed. Based on this, dynamic simulation models are derived which can be used for voltage stability investigations.…