中文

Slow crack growth : models and experiments

材料科学 2009-11-13 v1

摘要

The properties of slow crack growth in brittle materials are analyzed both theoretically and experimentally. We propose a model based on a thermally activated rupture process. Considering a 2D spring network submitted to an external load and to thermal noise, we show that a preexisting crack in the network may slowly grow because of stress fluctuations. An analytical solution is found for the evolution of the crack length as a function of time, the time to rupture and the statistics of the crack jumps. These theoretical predictions are verified by studying experimentally the subcritical growth of a single crack in thin sheets of paper. A good agreement between the theoretical predictions and the experimental results is found. In particular, our model suggests that the statistical stress fluctuations trigger rupture events at a nanometric scale corresponding to the diameter of cellulose microfibrils.

关键词

引用

@article{arxiv.cond-mat/0703746,
  title  = {Slow crack growth : models and experiments},
  author = {Stéphane Santucci and Loic Vanel and Sergio Ciliberto},
  journal= {arXiv preprint arXiv:cond-mat/0703746},
  year   = {2009}
}

备注

to be published in EPJ (European Physical Journal)