Pressure-induced metallization in solid boron
材料科学
2009-11-07 v1
摘要
Different phases of solid boron under high pressure are studied by first principles calculations. The -B structure is found to be stable up to 270 GPa. Its semiconductor band gap (1.72 eV) decreases continuously to zero around 160 GPa, where the material transforms to a weak metal. The metallicity, as measured by the density of states at the Fermi level, enhances as the pressure is further increased. The pressure-induced metallization can be attributed to the enhanced boron-boron interactions that cause bands overlap. These results are consist with the recently observed metallization and the associated superconductivity of bulk boron under high pressure (M.I.Eremets et al, Science{\bf 293}, 272(2001)).
引用
@article{arxiv.cond-mat/0109550,
title = {Pressure-induced metallization in solid boron},
author = {Jijun Zhao and Jian Ping Lu},
journal= {arXiv preprint arXiv:cond-mat/0109550},
year = {2009}
}
备注
14 pages, 5 figures