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The transistor transformed not only electronics but everyday life, and the integrated circuit - now simply the "chip" - made computation scalable and ubiquitous. Magnonics has long promised a parallel path to low-energy information…
In this work, we present a numerical model specifically designed for 3D multilayer devices, with a focus on nanobridge junctions and coplanar waveguides. Unlike existing numerical models, ours does not approximate the physical layout or…
Over the last decade, artificial intelligence has found many applications areas in the society. As AI solutions have become more sophistication and the use cases grew, they highlighted the need to address performance and energy efficiency…
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled…
Large language model (LLM) decoding is a major inference bottleneck because its low arithmetic intensity makes performance highly sensitive to memory bandwidth. 3D-stacked near-memory processing (NMP) provides substantially higher local…
Many quantum computing platforms are based on a two-dimensional physical layout. Here we explore a concept called looped pipelines which permits one to obtain many of the advantages of a 3D lattice while operating a strictly 2D device. The…
Mid-circuit measurements are a major bottleneck for superconducting quantum processors because they are slower and noisier than gates. Measurement-free quantum error correction (mfec) replaces repeated measurements and classical…
The basic building blocks for Resonant Tunnelling Diode (RTD) logic circuits are Threshold Gates (TGs) instead of the conventional Boolean gates (AND, OR, NAND, NOR) due to the fact that, when designing with RTDs, threshold gates can be…
Nowadays three dimension (3D) architectural visualisation has become a powerful tool in the conceptualisation, design and presentation of architectural products in the construction industry, providing realistic interaction and walkthrough…
Recent advances in three-dimensional laser writing have enabled direct nanostructuring deep within silicon, unlocking a volumetric design space previously inaccessible to surface-bound nanophotonic devices. Here, we introduce subwavelength…
As Deep Neural Networks (DNNs) continue to drive advancements in artificial intelligence, the design of hardware accelerators faces growing concerns over embodied carbon footprint due to complex fabrication processes. 3D integration…
We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform…
Real-time monocular 3D object detection remains challenging due to severe depth ambiguity, viewpoint shifts, and the high computational cost of 3D reasoning. Existing approaches either rely on LiDAR or geometric priors to compensate for…
With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…
While photonic integrated circuits (PICs) are being widely used in applications such as telecommunications and datacenter interconnects, PICs capable of replacing bulk optics and fibers in high-precision, highly-coherent applications will…
Applications such as augmented and virtual reality (AR/VR), optical atomic clocks, and quantum computing require photonic integration of (near-)visible laser sources to enable commercialization at scale. The heterogeneous integration of…
Three-dimensional (3D) topological codes offer the advantage of supporting fault-tolerant implementations of non-Clifford gates, yet their performance against realistic noise remains largely unexplored. In this work, we focus on the…
A three-dimensional (3D) Network-on-Chip (NoC) enables the design of high performance and low power many-core chips. Existing 3D NoCs are inadequate for meeting the ever-increasing performance requirements of many-core processors since they…
The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize design iterations and unexpected challenges. Emphasizing the pre-register-transfer…
Modular trapped-ion quantum computing hardware, known as QCCDs require shuttling operations in order to maintain effective all-to-all connectivity. Each module or trap can perform only one operation at a time, resulting in low intra-trap…