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The Last Level Cache (LLC) is the processor's critical bridge between on-chip and off-chip memory levels - optimized for high density, high bandwidth, and low operation energy. To date, high-density (HD) SRAM has been the conventional…
In this technical note, we provide a comparison of the design metrics of various quasi-delay-insensitive (QDI) asynchronous adders, where the adders correspond to diverse architectures. QDI adders are robust, and the objective of this…
This work introduces the design analysis simulation and a standard MEMS fabrication process for a three dimensional microcoil with a magnetic core and a digital switch configuration using a completely integrated fully MEMS compatible…
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In…
Qubit shuttling has become an indispensable ingredient for scaling leading quantum computing platforms, including semiconductor spin, neutral-atom, and trapped-ion qubits, enabling both crosstalk reduction and tighter integration of control…
Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical…
We introduce a family of scalable planar fault-tolerant circuits that implement logical non-Clifford operations on a 2D color code, such as a logical $T$ gate or a logical non-Pauli measurement that prepares a magic $|T\rangle$ state. The…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Reducing delay, power consumption, and chip area of a logic circuit are the main targets of a designer. Most of the times, the designer sacrifices power consumption and chip area to improve delay for a given technology node. To overcome…
Recently, significant progress has been achieved in sensing real large-scale outdoor 3D environments, particularly by using modern acquisition equipment such as LiDAR sensors. Unfortunately, they are fundamentally limited in their ability…
We report high qubit coherence as well as low crosstalk and single-qubit gate errors in a superconducting circuit architecture that promises to be tileable to 2D lattices of qubits. The architecture integrates an inductively shunted cavity…
Heterogeneous and monolithic integration of the versatile low loss silicon nitride platform with low temperature materials such as silicon electronics and photonics, III-V compound semiconductors, lithium niobate, organics, and glasses, has…
Crosstalk computing, involving engineered interference between nanoscale metal lines, offers a fresh perspective to scaling through co-existence with CMOS. Through capacitive manipulations and innovative circuit style, not only primitive…
The photonics landscape encompasses a wide scope of material platforms, each optimized for specific functionalities, yet no platform meets the demands of all current and evolving photonic applications. While combining integrated photonics…
As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is…
Enhancement of the number and array density of nozzles within an inkjet head chip is one of the keys to raise the printing speed and printing resolutions. However, traditional 2D architecture of driving circuits can not meet the requirement…
In recent times, three-dimensional (3D) metamaterials have undergone a revolution driven mainly by the popularization of 3D-printing techniques, which has enabled the implementation of modern microwave and photonic devices with advanced…
The proliferation of quantum computing technologies has fueled the race to build a practical quantum computer. The spectrum of the innovation is wide and encompasses many aspects of this technology, such as the qubit, control and detection…
The substantial memory bandwidth and computational demands of large language models (LLMs) present critical challenges for efficient inference. To tackle this, the literature has explored heterogeneous systems that combine neural processing…
Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simulation, and dismiss the complex nonlinear thermal effects,…