Related papers: Monolithic 3D Integration for Null Convention Logi…
Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of…
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…
This paper proposes a ternary signalling scheme for inductive coupling links (ICLs) in 3D-integrated circuits (3D-ICs) to reduce crosstalk and electromagnetic interference in multi-stacked chip communications. By converting binary data into…
Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
In order to simulate the mechanical behavior of large structures assembled from thin composite panels, we propose a coupling technique which substitutes local 3D models for the global plate model in the critical zones where plate modeling…
This paper presents Omni 3D - a 3D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D arbitrarily interleaves metal layers for both signal/power with FETs in 3D (i.e., nFETs and…
We design quantum circuits by using the standard cell approach borrowed from classical circuit design, which can speed-up the layout of circuits with a regular structure. Our standard cells are general and can be used for all types of…
Practical large-scale quantum computation requires both efficient error correction and robust implementation of logical operations. Three-dimensional (3D) color codes are a promising candidate for fault-tolerant quantum computation due to…
Computing the electric eddy currents in non-linear materials, such as superconductors, is \E{not straightforward}. The design of superconducting magnets and power applications needs electromagnetic computer modeling, being in many cases a…
With the development of quantum hardware bringing the error-corrected quantum circuits to the near future, the lack of an efficient polynomial-time decoding algorithms for logical circuits presents a critical bottleneck. While quantum…
Nonlinear microwave circuits are key elements for many groundbreaking research directions and technologies, such as quantum computation and quantum sensing. The majority of microwave circuits with Josephson nonlinearities to date is based…
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…
The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms,…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
Ultra-low noise lasers are essential tools in a wide variety of applications, including data communication, light detection and ranging (LiDAR), quantum computing and sensing, and optical metrology. Recent advances in integrated photonics,…
Numerical simulations have become an essential design tool in the field of photonics, especially for nanophotonics. In particular, 3D finite-difference-time-domain (FDTD) simulations are popular for their powerful design capabilities.…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
We present a photonic coupler that exhibits effectively wavelength-agnostic performance for ultra-broadband optical interfacing. By incorporating a dual-ellipsoidal geometry, the design facilitates quasi-free-space optical propagation. We…
We investigate theoretically photonic chips with monolithically integrated blue light sources. According to our evaluations, a group-III nitride light emitting heterostructure can be efficiently combined with silicon nitride waveguiding…