Related papers: Monolithic 3D Integration for Null Convention Logi…
The rapid growth of LLMs demands high-throughput, memory-capacity-intensive inference on resource-constrained edge devices, where single-batch decoding remains fundamentally memory-bound. Existing out-of-core GPU-based and SSD-like…
Achieving fast and continuous fabrication of large-scale complex 3D structures is key to unlocking industrial-scale adoption of two-photon lithography (TPL). Despite substantial improvement in peak optical patterning rates enabled by recent…
Efficiently coupling light from optical fibers into photonic integrated circuits is a key step toward practical photonic devices. While a notable coupling can be achieved by out of plane couplers such as grating couplers, their basic planar…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
Of the many potential hardware platforms, superconducting quantum circuits have become the leading contender for constructing a scalable quantum computing system. All current architecture designs necessitate a 2D arrangement of…
3D FPGAs have recently been produced as the next generation of the FPGA family to continue the integration of more transistors on a single chip seamlessly. In this paper, we propose a complete CAD flow to implement an arbitrary logic…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
The high demand for 3D imaging in intelligent robotics is motivating the advances of coherent LiDARs towards high performances with low complexity/cost. However, the current coherent LiDARs suffer from the tight coupling between the high…
Performance optimization associated with optical modulators requires reasonably accurate predictive models for key figures of merit. Interleaved PN-junction topology offers the maximum mode/junction overlap and is the most efficient…
In this paper, we focus on temperature-aware Monolithic 3D (Mono3D) deep neural network (DNN) inference accelerators for biomedical applications. We develop an optimizer that tunes aspect ratios and footprint of the accelerator under…
FASTEST-3D is an MPI-parallel finite-volume flow solver based on block-structured meshes that has been developed at the University of Erlangen-Nuremberg since the early 1990s. It can be used to solve the laminar or turbulent incompressible…
Reliable perception of the environment plays a crucial role in enabling efficient self-driving vehicles. Therefore, the perception system necessitates the acquisition of comprehensive 3D data regarding the surrounding objects within a…
Due to the limitations either on the sizes of devices and signal routing channels, the current planar integrated optical waveguide circuits await for the further developments into the three-dimensional (3D) integrations, although their…
The demand for advanced photonics technology is increasing rapidly, fueled by the necessity for high-performance and cost-effective optical information processing systems extending into the quantum domain. Silicon, benefiting from its…
This paper describes the design and characteristics of monolithically integrated three-terminal gated III-Nitride light emitting diodes (LEDs) devices. The impact of channel doping and thickness on the voltage penalty of the transistor-LED…
Quantum-dot Cellular Automata (QCA) as a nanoscale transistor-less device technology offers distinguishing advantages over the limitations of CMOS circuits. While more than 2 decades of design progress have been achieved with QCA, a…
We introduce an ion trap platform based on a 3D-printed micro-junction array, designed to implement quantum charge-coupled device (QCCD) architectures for large-scale quantum information processing (QIP). The integration of…
3D lookup tables (3D LUTs) are a key component for image enhancement. Modern image signal processors (ISPs) have dedicated support for these as part of the camera rendering pipeline. Cameras typically provide multiple options for picture…
Silicon nitride (Si3N4), as a complementary metal-oxide-semiconductor (CMOS) material, finds wide use in modern integrated circuit (IC) technology. The past decade has witnessed tremendous development of Si3N4 in photonic areas, with…
With fault-tolerant quantum computing (FTQC) on the horizon, it is critical to understand sources of logical error in plausible hardware implementations of quantum error-correcting codes (QECC). In this work, we consider logical error rates…