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The rapid adaptation of data driven AI models, such as deep learning inference, training, Vision Transformers (ViTs), and other HPC applications, drives a strong need for runtime precision configurable different non linear activation…
Chiplet architectures are on the rise as they promise to overcome the scaling challenges of monolithic chips. A key component of such architectures is an efficient inter-chiplet interconnect (ICI). The ICI design space is huge as there are…
Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…
Placement is a critical task with high computation complexity in VLSI physical design. Modern analytical placers formulate the placement objective as a nonlinear optimization task, which suffers a long iteration time. To accelerate and…
Memory tiering systems seek cost-effective memory scaling by adding multiple tiers of memory. For maximum performance, frequently accessed (hot) data must be placed close to the host in faster tiers and infrequently accessed (cold) data can…
The article is aimed to address a mutually boosting use of asymptotic analysis and machine learning, for fast stiffness design of configurations infilled with smoothly-varying graded microstructures. The discussion is conducted in the…
Thermal density and hot spots limit three-dimensional (3D) implementation of massively-parallel SIMD processors and prohibit stacking DRAM dies above them. This study proposes replacing SIMD by an Associative Processor (AP). AP exhibits…
To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However, previous tools struggle to handle the unique heterogeneous…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
We present a new technique of VLSI chip-level thermal analysis. We extend a newly developed method of solving two dimensional Laplace equations to thermal analysis of four adjacent materials on a mother board. We implement our technique in…
The recent advances in machine learning, in general, and Artificial Neural Networks (ANN), in particular, has made smart embedded systems an attractive option for a larger number of application areas. However, the high computational…
Nowadays nanoscale combinational circuits are facing significant reliability challenges including soft errors and process variations. This paper presents novel process variation-aware placement strategies that include two algorithms to…
Thermal Interface Materials (TIMs) are widely used in electronic packaging. Increasing power density and limited assembly space pose high demands on thermal management. Large cooling surfaces need to be covered efficiently. When joining the…
For its advantage in GPU acceleration and less dependency on human experts, machine learning has been an emerging tool for solving the placement and routing problems, as two critical steps in modern chip design flow. Being still in its…
This paper addresses the challenges of thermal sensor allocation and full-chip temperature reconstruction in multi-core systems by leveraging an entropy-based sensor placement strategy and an adaptive compressive sensing approach. By…
In recent years, deep learning models have become ubiquitous in industry and academia alike. Modern deep neural networks can solve one of the most complex problems today, but coming with the price of massive compute and storage…
The suboptimal physical design of the integrated circuits may not only increase the manufacturing costs due to the larger size of the chip but can also impact its performance by placing interconnected rectangular devices too far from each…
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling algorithm for embedded systems. The algorithm is used as a…
Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…