Related papers: ATMPlace: Analytical Thermo-Mechanical-Aware Place…
The ALICE ITS3 project foresees the use of ultra-light MAPS, developed in the 65 nm imaging process, for the vertex detector in the ALICE experiment at the LHC to drastically improve the vertexing performance. This new development,…
Monolithic Active Pixel Sensors (MAPS) combine the sensing part and the front-end electronics in the same silicon layer, making use of CMOS technology. Profiting from the progresses of this commercial process, MAPS have been undergoing…
The Inner Tracking System (ITS) Upgrade for the ALICE experiment at LHC is the first large-area ($\sim$10~m$^2$) silicon vertex detector based on the CMOS Monolithic Active Pixel Sensor (MAPS) technology, which combines sensitive volume and…
Distributed execution of deep learning training involves a dynamic interplay between hardware accelerator architecture and device placement strategy. This is the first work to explore the co-optimization of determining the optimal…
Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and throughput demands. Even though modern digital electronic…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
Object placement in robotic tasks is inherently challenging due to the diversity of object geometries and placement configurations. To address this, we propose AnyPlace, a two-stage method trained entirely on synthetic data, capable of…
Explosive growth in energy-intensive AI data centers is outstripping the pace of power grid interconnection and transmission expansion. While operational flexibility has been proposed to mitigate this stress, existing processes are often…
As persistent memory (PM) technologies emerge, hybrid memory architectures combining DRAM with PM bring the potential to provide a tiered, byte-addressable main memory of unprecedented capacity. Nearly a decade after the first proposals for…
2D Key-point estimation is an important precursor to 3D pose estimation problems for human body and hands. In this work, we discuss the data, architecture, and training procedure necessary to deploy extremely efficient 2.5D hand pose…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
The growing demand for efficient, high-performance processing in machine learning (ML) and image processing has made hardware accelerators, such as GPUs and Data Streaming Accelerators (DSAs), increasingly essential. These accelerators…
The increasing demand for memory in hyperscale applications has led to memory becoming a large portion of the overall datacenter spend. The emergence of coherent interfaces like CXL enables main memory expansion and offers an efficient…
The Inner Tracking System (ITS) of the ALICE experiment will be upgraded during the second long LHC shutdown in $\mathrm{2019}-\mathrm{2020}$. The main goal of the ALICE ITS Upgrade is to enable high precision measurements of low - momentum…
Technology mapping involves mapping logical circuits to a library of cells. Traditionally, the full technology library is used, leading to a large search space and potential overhead. Motivated by randomly sampled technology mapping case…
Precise and real-time visual localization is critical for applications like AR/VR and robotics, especially on resource-constrained edge devices such as smart glasses, where battery life and heat dissipation can be a primary concerns. While…
Thermal management of power electronics and Electronic Control Units is crucial in times of increasing power densities and limited assembly space. Electric and autonomous vehicles are a prominent application field. Thermal Interface…
This paper presents EMSpice~3, a full-chip multiphysics framework for coupled electromigration (EM), thermomigration (TM), and IR-drop analysis of practical power-grid (P/G) networks. The framework is, to our knowledge, the first EM-IR…
The increasing transistor scale integration poses, among others, the thermal-aware floorplanning problem; consisting of how to place the hardware components in order to reduce overheating by dissipation. Due to the huge amount of feasible…
We present thermopneumatic pixels (TPPs), which are tactile actuators designed for rapid fabrication and straightforward integration into compact wearable and surface-based haptic systems. Each TPP converts low-voltage ($\sim$10 V)…