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Recent open-vocabulary 3D scene understanding approaches mainly focus on training 3D networks through contrastive learning with point-text pairs or by distilling 2D features into 3D models via point-pixel alignment. While these methods show…
3D video coding is one of the most popular research area in multimedia. This paper reviews the recent progress of the coding technologies for multiview video (MVV) and free view-point video (FVV) which is represented by MVV and depth maps.…
Invisible cloaking is one of major outcomes of the metamaterial research, but the practical potential, in particular for high frequencies (e.g., microwave to visible light), is fatally challenged by the complex material properties they…
One route to create tunable metamaterials is through integration with "on-demand" dynamic quantum materials, such as vanadium dioxide (VO2). This enables new modalities to create high performance devices for historically challenging…
Real-time spatial monitoring in underground longwall operations is challenging due to methane-related safety risks, poor visibility, elevated thermal loads, spatial confinement, and bandwidth-limited communications. Currently available…
Quantum Error Mitigation is essential for enhancing the reliability of quantum computing experiments. The adaptive KIK error mitigation method has demonstrated significant advantages, including resilience to temporal noise drifts,…
The Von Neumann bottleneck, which relates to the energy cost of moving data from memory to on-chip core and vice versa, is a serious challenge in state-of-the-art AI architectures, like Convolutional Neural Networks' (CNNs) accelerators.…
Magnetically induced optical transparency (MIOT) is a technique to realize the narrow transmission spectrum in a cavity quantum electric dynamics (cavity QED) system, which is demonstrated in the recent experiment of cold 88Sr atoms in an…
Atomically thin two-dimensional (2D) materials are promising candidates for sub-10 nm transistor channels due to their ultrathin body thickness, which results in strong electrostatic gate control. Properly scaling a transistor technology…
The unabated growth in AI workload demands is driving the need for concerted advances in compute, memory, and interconnect performance. As traditional semiconductor scaling slows, high-speed interconnects have emerged as the new scaling…
This paper critically examines the leakage current reduction techniques for improving the performance of poly-Si TFTs used in active matrix liquid crystal displays. This is a first comprehensive study in literature on this topic. The review…
Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…
Monolithic 3D stackable 1T1C DRAM technology is on the rise, with initial prototypes reported by the industry. This work presents a comprehensive reliability study focusing on the intricate interplay between the row hammer effect and the…
In this work, using 3D device simulation, we perform an extensive gate to source/drain underlap optimization for the recently proposed hybrid transistor, HFinFET, to show that the underlap lengths can be suitably tuned to improve the on-off…
This paper describes the design and characteristics of monolithically integrated three-terminal gated III-Nitride light emitting diodes (LEDs) devices. The impact of channel doping and thickness on the voltage penalty of the transistor-LED…
Reconstructing an object's high-quality 3D shape with inherent spectral reflectance property, beyond typical device-dependent RGB albedos, opens the door to applications requiring a high-fidelity 3D model in terms of both geometry and…
Low power consumption in both static and dynamic modes of operation is a key requirement in modern, highly scaled nanoelectronics. Tunneling field-effect transistors (TFETs) that exploit direct band-to-band tunneling of charges and exhibit…
3D DRAM has emerged as a promising approach for continued density scaling, but its viability is limited by routing and hybrid bonding constraints to periphery, which may degrade sensing margin, latency, and array efficiency. With device…
Large intelligent surface (LIS) has recently emerged as a potential low-cost solution to reshape the wireless propagation environment for improving the spectral efficiency. In this paper, we consider a downlink millimeter-wave (mmWave)…
Integrating semiconducting and magnetic materials could combine transistor-like operation with nonvolatility and enable architectures such as logic-in-memory. Here, we employ correlated electrical transport and scanning nitrogen-vacancy…