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As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is…
We present the results of the characterization of pixel modules composed of 75 um thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at…
As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate…
The ever-increasing size and computational complexity of today's machine-learning algorithms pose an increasing strain on the underlying hardware. In this light, novel and dedicated architectural solutions are required to optimize energy…
The motivation of our work is to present a new visualization-guided computing paradigm to combine direct 3D volume processing and volume rendered clues for effective 3D exploration such as extracting and visualizing microstructures in-vivo.…
The development of integrated semiconductor lasers has miniaturized traditional bulky laser systems, enabling a wide range of photonic applications. A progression from pure III-V based lasers to III-V/external cavity structures has…
The input tokens to Vision Transformers carry little semantic meaning as they are defined as regular equal-sized patches of the input image, regardless of its content. However, processing uniform background areas of an image should not…
Sub-1-nm gate length $MoS_2$ transistors have been experimentally fabricated, but their device performance limit remains elusive. Herein, we explore the performance limits of the sub-1-nm gate length monolayer (ML) $MoS_2$ transistors…
Semiconductor research has shifted towards exploring two-dimensional (2D) materials as candidates for next-generation electronic devices due to the limitations of existing silicon technology. Transition Metal Dichalcogenides (TMDCs) stand…
Integrated access and backhaul (IAB) is envisioned as a possible solution to address the need for network densification in situations where fiber connection is not viable. In Release 18, 3rd generation partnership project (3GPP) will take…
The performance and scalability of two-dimensional (2D) field-effect transistors (FETs) are strongly influenced by geometry-defined electrostatics. In most 2D FET studies, the gate overlaps with the source and drain electrodes, allowing the…
To improve transistor density and electronic performance, next-generation semiconductor devices are adopting three-dimensional architectures and feature sizes down to the few-nm regime, which require atomic-scale metrology to identify and…
Two-dimensional van der Waals semiconductors are promising for future nanoelectronics. However, integrating high-k gate dielectrics for device applications is challenging as the inert van der Waals material surfaces hinder uniform…
Multifunctional three-dimensional (3-D) nano-architectures, integrating all device components within tens of nanometers, offer great promise for next generation electrical energy storage applications, but have remained challenging to…
Expanding far beyond traditional applications in optical interconnects at telecommunications wavelengths, the silicon nanophotonic integrated circuit platform has recently proven its merits for working with mid-infrared (mid-IR) optical…
This work presents a novel monolithic 3D (M3D) FPGA architecture that leverages stackable back-end-of-line (BEOL) transistors to implement configuration memory and pass gates, significantly improving area, latency, and power efficiency. By…
This work investigates the effect of double intelligent reflecting surface (IRS) in improving the spectrum efficient of multi-user multiple-input multiple-output (MIMO) network operating in the millimeter wave (mmWave) band. Specifically,…
Hybrid analog-digital precoding significantly reduces the hardware costs in massive MIMO transceivers when compared to fully-digital precoding at the expense of increased transmit power. In order to mitigate the above shortfall, we use the…
Singular value decomposition (SVD) is widely used in wireless systems, including multiple-input multiple-output (MIMO) processing and dimension reduction in distributed MIMO (D-MIMO). However, the iterative nature of decomposition methods…
Mediated by today's visual displays, information space allows users to discover, access and interact with a wide range of digital and physical information. The information presented in this space may be digital, physical or a blend of both,…