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3D detailed radiative transfer is computationally taxing, since the solution of the radiative transfer equation involves traversing the six dimensional phase space of the 3D domain. With modern supercomputers the hardware available for…
Light-emitting diodes (LEDs) can bridge the gap between narrow linewidth, expensive lasers and broadband, inefficient thermal globars for low-cost chemical sensing in the mid-infrared (mid-IR). However, the efficiency of III-V based mid-IR…
We investigate the design of steep-slope metal-oxide-semiconductor field-effect transistors (MOSFETs) exploiting monolayers of transition metal dihalides as channel materials. With respect to other previously proposed steep-slope…
Large-scale arrays of Microwave Kinetic Inductance Detectors (MKIDs) are attractive candidates for use in imaging instruments for next generation submillimeter-wave telescopes such as CCAT. We have designed and fabricated tightly packed…
We report high qubit coherence as well as low crosstalk and single-qubit gate errors in a superconducting circuit architecture that promises to be tileable to 2D lattices of qubits. The architecture integrates an inductively shunted cavity…
The atomic structure at the interface between two-dimensional (2D) and three-dimensional (3D) materials influences properties such as contact resistance, photo-response, and high-frequency electrical performance. Moir\'e engineering is yet…
Molybdenum disulfide is considered as one of the most promising two-dimensional semiconductors for electronic and optoelectronic device applications. So far, the charge transport in monolayer molybdenum disulfide is dominated by extrinsic…
Transformer-based end-to-end speech recognition has achieved great success. However, the large footprint and computational overhead make it difficult to deploy these models in some real-world applications. Model compression techniques can…
Stacked intelligent metasurfaces (SIMs), which integrate multiple programmable metasurface layers, have recently emerged as a promising technology for advanced wave-domain signal processing. SIMs benefit from flexible spatial…
On-chip coherent laser sources are crucial for the future of photonic integrated circuits, yet progress has been hindered by the complex interplay between material quality, device geometry, and performance metrics. We combine…
Mode-division multiplexing has emerged as a promising route for increasing transmission capacity while maintaining the same level of on-chip integration. Despite the large number of on-chip mode converters and multiplexers reported for the…
Most advances in metaoptics have been made at visible wavelengths and above; in contrast, the vacuum ultraviolet (VUV) has barely been explored despite numerous scientific and technological opportunities. Creating metaoptic elements at this…
Epitaxially integrated III-V semiconductor lasers for silicon photonics have the potential to dramatically transform information networks, but currently, dislocations limit performance and reliability even in defect tolerant InAs quantum…
Millimeter wave (mmWave) massive MIMO can achieve orders of magnitude increase in spectral and energy efficiency, and it usually exploits the hybrid analog and digital precoding to overcome the serious signal attenuation induced by mmWave…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…
Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and throughput demands. Even though modern digital electronic…
A requirement for quantum information processors is the in-situ tunability of the tunnel rates and the exchange interaction energy within the device. The large energy level separation for atom qubits in silicon is well suited for qubit…
Micro-transfer printing is an assembly technology that enables large-scale integration of diverse materials and components from micro- to nano-scale. However, traditional micro-transfer printing technologies lack dynamic selectivity,…
In the past few years, we have witnessed an increased interest in the use of 2D materials for the realization of hybrid photonic nonlinear waveguides. Although graphene has attracted most of the attention, other families of 2D materials…
The power and energy consumption of resistive switching devices can be lowered by reducing their active layer dimensions. Efforts to push this low-energy switching property to its limits have led to the investigation of active regions made…