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The direct growth of III-V materials on silicon is a key enabler for developing monolithically integrated lasers, offering substantial potential for ultra-dense photonic integration in vital communications and computing technologies.…
1T1R (1-transistor-1-resistor) memory crossbar arrays represent a promising solution for compute-in-memory matrix-vector multiplication accelerators and embedded or storage-class memory. However, the size and scaling of these arrays are…
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…
Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…
Molecular communication is a new field of communication where molecules are used to transfer information. Among the proposed methods, molecular communication via diffusion (MCvD) is particularly effective. One of the main challenges in MCvD…
Recently, significant progress has been achieved in sensing real large-scale outdoor 3D environments, particularly by using modern acquisition equipment such as LiDAR sensors. Unfortunately, they are fundamentally limited in their ability…
In this paper, we have experimentally demonstrated, for the first time, III-V 4D transistors with vertically stacked InGaAs nanowire (NW) channels and gate-all-around (GAA) architecture. Novel process technology enabling the transition from…
Two-dimensional (2D) semiconductors are widely recognized as attractive channel materials for low-power electronics. However, an unresolved challenge is the integration of high-quality, ultrathin high-\k{appa} dielectrics that fully meet…
Hardware implementations of the Ising model offer promising solutions to large-scale optimization tasks. In the literature, various nanodevices have been shown to emulate the spin dynamics for such Ising machines with remarkable…
Multimodal transformer exhibits high capacity and flexibility to align image and text for visual grounding. However, the existing encoder-only grounding framework (e.g., TransVG) suffers from heavy computation due to the self-attention…
This paper presents an extension to visual inertial odometry (VIO) by introducing tightly-coupled fusion of magnetometer measurements. A sliding window of keyframes is optimized by minimizing re-projection errors, relative inertial errors,…
Vertical field effect transistors (VFETs) show many advantages such as high switching speed, low operating voltage, low power consumption, and miniaturization over lateral FETs. However, VFET still faces the main challenges of high…
The separation and optimization of noise components is critical to microwave-kinetic inductance detector (MKID) development. We analyze the effect of several changes to the lumped-element inductor and interdigitated capacitor geometry on…
The end of conventional Dennard scaling and the widening gap between memory bandwidth and arithmetic throughput have made the von Neumann partition a structural bottleneck rather than a transient one. Two-dimensional (2D) materials, with…
Limited memory bandwidth is a critical bottleneck in modern systems. 3D-stacked DRAM enables higher bandwidth by leveraging wider Through-Silicon-Via (TSV) channels, but today's systems cannot fully exploit them due to the limited internal…
The escalating demands of compute-intensive applications urgently necessitate the adoption of optical interconnect technologies to overcome bottlenecks in scaling computing systems. This requires fully exploiting the inherent parallelism of…
Recent nano-technological advances enable the Monolithic 3D (M3D) integration of multiple memory and logic layers in a single chip, allowing for fine-grained connections between layers and significantly alleviating main memory bottlenecks.…
Enhancement of the number and array density of nozzles within an inkjet head chip is one of the keys to raise the printing speed and printing resolutions. However, traditional 2D architecture of driving circuits can not meet the requirement…
We present the design, fabrication, and measurement of a monolithically integrated optical receiver analog front end, where low power operation is a primary consideration with a goal of supporting 56 Gbaud intensity modulated direct detect…
Active metasurfaces enable dynamic control of light for applications in beam steering, pixelated holography, and adaptive optics, but demonstrations of two-dimensional (2D) electrically addressable arrays have so far been limited. Here we…