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Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
Theoretically, the three-dimensional (3D) array architecture provides a higher communication degree of freedom (DoF) compared to the planar arrays, allowing for greater capacity potential in multiple-input multiple-output (MIMO) systems.…
Performance optimization associated with optical modulators requires reasonably accurate predictive models for key figures of merit. Interleaved PN-junction topology offers the maximum mode/junction overlap and is the most efficient…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
The demand for advanced photonics technology is increasing rapidly, fueled by the necessity for high-performance and cost-effective optical information processing systems extending into the quantum domain. Silicon, benefiting from its…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Ultrathin freestanding membranes with a pronounced metal-insulator transition (MIT) provides huge potential in future flexible electronic applications as well as a unique aspect of the study of lattice-electron interplay. However, the…
The evolution of quantization and mixed-precision techniques has unlocked new possibilities for enhancing the speed and energy efficiency of NNs. Several recent studies indicate that adapting precision levels across different parameters can…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
With the potential to provide a clean break from massive multiple-input multiple-output, large intelligent surfaces (LISs) have recently received a thrust of research interest. Various proposals have been made in the literature to define…
Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in…
Central to interatomic potential efficiency is the radial envelope function that enables linear scaling with computational cost by defining a local neighborhood of atoms. This has enabled MLIPs to revolutionize materials science over the…
We have fabricated 2024 pixel microwave kinetic inductance detector (MKID) arrays in the ultraviolet/optical/near-IR (UVOIR) regime that are currently in use in astronomical instruments. In order to make MKIDs desirable for novel…
3-dimensional Multiple-Input Multiple-Output (3D MIMO) systems have received great interest recently because of the spatial diversity advantage and capability for full-dimensional beamforming, making them promising candidates for practical…
Recent advances in learned image compression (LIC) have achieved remarkable performance improvements over traditional codecs. Notably, the MLIC series-LICs equipped with multi-reference entropy models-have substantially surpassed…
We propose and demonstrate a hybrid silicon and lithium niobate Michelson Interferometer Modulator (MIM) with enhanced modulation efficiency compared to a Mach-Zehnder modulator. The modulator is based on seamless integration of a…
Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…