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Silicon photonics, compatible with large-scale silicon manufacturing, is a disruptive photonic platform that has indicated significant implications in industry and research areas (e.g., quantum, neuromorphic computing, LiDAR). Cutting-edge…
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
In contrast to monolithic devices, modular, networked quantum architectures are based on interconnecting smaller quantum hardware nodes using quantum communication links, and offer a promising approach to scalability. Virtual distillation…
The growing demand for more efficient data transmission has made nanoscale high-throughput all-optical switching a critical requirement in modern telecommunication systems. Metasurface-based platforms offer unique advantages because of…
Microfluidic mixing is a fundamental functionality in most lab on a chip (LOC) systems,whereas realization of efficient mixing is challenging in microfluidic channels due to the small Reynolds numbers. Here, we design and fabricate a…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
The main advantage of Microwave Kinetic Inductance Detector arrays (MKID) is their multiplexing capability, which allows for building cameras with a large number of pixels and good sensitivity, particularly suitable to perform large blank…
Three-dimensional (3D) superconducting microwave cavities with large mode volumes typically have high quality factors ($>10^6$). This is due to a reduced sensitivity to surface dielectric losses, which is the limiting source of dissipation…
The state-of-the-art CMOS technology has started to adopt three-dimensional (3D) integration approaches, enabling continuous chip density increment and performance improvement, while alleviating difficulties encountered in traditional…
While photonic integrated circuits (PICs) are being widely used in applications such as telecommunications and datacenter interconnects, PICs capable of replacing bulk optics and fibers in high-precision, highly-coherent applications will…
The data transfer between a processor and memory has become a design bottleneck in data-intensive applications. Processing-In-Memory (PIM) is a practical approach to overcome the memory wall bottleneck. The 4:2 compressor is suitable for…
Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In…
FASTEST-3D is an MPI-parallel finite-volume flow solver based on block-structured meshes that has been developed at the University of Erlangen-Nuremberg since the early 1990s. It can be used to solve the laminar or turbulent incompressible…
The continuous scaling of semiconductor-based technologies to micron and sub-micron regimes has resulted in higher device density and lower power dissipation. Many physical phenomena such as self-heating or current leakage become…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
Metasurfaces have emerged as a powerful platform to control free-space light at the subwavelength scale, enabling applications in sensing, lasing, nonlinear optics, and quantum photonics. However, their practical deployment is hindered by…
With scaling of Vt sub-threshold leakage power is increasing and expected to become significant part of total power consumption In present work three new configurations of level shifters for low power application in 0.35{\mu}m technology…
The Micro Vertex Detector (MVD) is the most upstream detector of the fixed-target Compressed Baryonic Matter Experiment (CBM) at the future Facility for Antiproton and Ion Research (FAIR). It enables high-precision low-momentum tracking in…