Related papers: Integration and Packaging
Perception in 3D has become standard practice for a large part of robotics applications. High quality 3D perception is costly. Our previous work on a nodding 2D Lidar provides high quality 3D depth information with low cost, but the sparse…
The development of single-photon counting detectors and arrays has made tremendous steps in recent years, not the least because of various new applications in, e.g., LIDAR devices. In this work, a 3D imaging device based on real thermal…
Integrated quantum photonics holds significant promise for scalable photonic quantum information processing, quantum repeaters, and quantum networks, but its development is hindered by the mismatch between materials hosting high-quality…
Pixel detectors for precise particle tracking in high energy physics have been developed to a level of maturity during the past decade. Three of the LHC detectors will use vertex detectors close to the interaction point based on the hybrid…
3D silicon detectors, in which the electrodes penetrate the sensor bulk perpendicular to the surface, have recently undergone a rapid development from R\&D over industrialisation to their first installation in a real high-energy-physics…
Dielectric optical waveguides constitute the main building blocks of photonic integrated circuits (PICs). Channels with high refractive index contrast can provide very compact PIC components whereas structures with lower index exhibit less…
In recent years, MEMS inertial sensors (3D accelerometers and 3D gyroscopes) have become widely available due to their small size and low cost. Inertial sensor measurements are obtained at high sampling rates and can be integrated to obtain…
Visible and near-infrared(NIR) band sensors provide images that capture complementary spectral radiations from a scene. And the fusion of the visible and NIR image aims at utilizing their spectrum properties to enhance image quality.…
Vacuum-forming is a common manufacturing technique for constructing thin plastic shell products by pressing heated plastic sheets onto a mold using atmospheric pressure. Vacuum-forming is ubiquitous in packaging and casing products in…
In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low…
Three-dimensional (3D) imaging of thin, extended specimens at nanometer resolution is critical for applications in biology, materials science, advanced synthesis, and manufacturing. One route to 3D imaging is tomography, which requires a…
Compressive displays are an emerging technology exploring the co-design of new optical device configurations and compressive computation. Previously, research has shown how to improve the dynamic range of displays and facilitate…
Accurate 3D volumetric mapping is critical for autonomous underwater vehicles operating in obstacle-rich environments. Vision-based perception provides high-resolution data but fails in turbid conditions, while sonar is robust to lighting…
We introduce Patchwork, a new general-purpose shape representation capable of modeling 2D and 3D geometry with a small number of parameters. Patchwork is grounded in a rigorous mathematical framework, providing provable complexity bounds…
The interference between radiation fields superposed appropriately contains all available information about the source. This will be recapitulated for coherent and incoherent fields. We will further analyze a new kind of twisted 3D…
Generations of technologies with fundamentally new information processing capabilities will emerge if microscopic physical systems can be controlled to encode, transmit, and process quantum information, at scale and with high fidelity. In…
3D additive manufacturing enables the fabrication of nanophotonic structures with subwavelength features that control light across macroscopic scales. Gradient-based optimization offers an efficient approach to design these complex and…
As the demand for high-speed and low-power electronics continues to grow, the quasi-delay-insensitive (QDI) asynchronous domain of digital design has emerged as a promising alternative to traditional clock-based designs. However, the…
The experiment of the future electron-positron colliders has unprecedented requirements on the vertex resolution, such as around 3micron single point resolution for the inner most detector layer, with fast readout, and very low…
Recent technological advances in integrated photonics have spurred on the study of topological phenomena in engineered bosonic systems. Indeed, the controllability of silicon ring-resonator arrays has opened up new perspectives for building…