Related papers: Integration and Packaging
Photonic Integrated Circuits (PICs) provide superior speed, bandwidth, and energy efficiency, making them ideal for communication, sensing, and quantum computing applications. Despite their potential, PIC design workflows and integration…
CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher…
The abstract discusses the significance of Visible Light Communication (VLC) as an efficient and cost-effective solution in the era of green technology. VLC not only provides illumination but also high-speed data transmission through…
This study constructs a hybrid module with a multi-material collaborative detection architecture by integrating silicon pixel layers into the longitudinally segmented scintillating fiber sampling calorimeter module and optimizes the…
We challenge the current thinking and approach to the design of photonic integrated circuits (PICs) for applications in communications, quantum information and sensing. The standard PICs are based on directional couplers, that provide a…
We design and demonstrate a monolithically integrated silicon photonic multichannel optical hybrid for versatile broadband coherent reception, addressing the critical limitations of current wavelength multiplexed systems in scalability and…
The High Luminosity upgrade of the CERN Large Hadron Collider will be able to reach a peak instantaneous luminosity of 5E34/cm2 s. The innermost detectors of the CMS and ATLAS experiments will have to cope with unprecedented requirements on…
Pixel vertex detectors are THE instrument of choice for the tracking of charged particles close to the interaction point at the LHC. Hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present state…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
Symmetric informationally complete measurements are both important building blocks in many quantum information protocols and the seminal example of a generalised, non-orthogonal, quantum measurement. In higher-dimensional systems, these…
Quantum dot (QD) lay-outs are becoming more complex as the technology is being applied to more complex multi-QD structures. This increase in complexity requires improved capacitance modeling both for design and accurate interpretation of QD…
Polarization is a fundamental property of light that carries distinct and valuable information. Consequently, its precise measurement is crucial for numerous applications, including biomedical imaging, remote sensing, and optical…
Silicon nitride (Si3N4), as a complementary metal-oxide-semiconductor (CMOS) material, finds wide use in modern integrated circuit (IC) technology. The past decade has witnessed tremendous development of Si3N4 in photonic areas, with…
This paper presents a compact and accurate representation of 3D scenes that are observed by a LiDAR sensor and a monocular camera. The proposed method is based on the well-established Stixel model originally developed for stereo vision…
We report on two edge-coupling and power splitting devices for hybrid integration of III-V lasers with sub-micrometric silicon-on-insulator (SOI) waveguides. The proposed devices relax the horizontal alignment tolerances required to achieve…
Silicon photonic integration has gained great success in many application fields owing to the excellent optical device properties and complementary metal-oxide semiconductor (CMOS) compatibility. Realizing monolithic integration of III-V…
Complex plasmas consist of microparticles embedded in a low-temperature plasma containing ions, electrons and neutral particles. The microparticles form a dynamical system that can be used to study a multitude of effects on the level of the…
We present the results of the characterization of pixel modules composed of 75 um thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at…
Lidars and cameras are critical sensors that provide complementary information for 3D detection in autonomous driving. While most prevalent methods progressively downscale the 3D point clouds and camera images and then fuse the high-level…
Cold atoms are important for precision atomic applications including timekeeping and sensing. The 3D magneto-optical trap (3D-MOT), used to produce cold atoms, will benefit from photonic integration to improve reliability and reduce size,…