Related papers: Integration and Packaging
Silicon photonic integrated circuits offer significant improvements in processing bandwidth, power efficiency, and low latency, addressing the needs of future microwave communication systems. Several successful applications have been…
Integrated photonics is a powerful contender in the race for a fault-tolerant quantum computer, claiming to be a platform capable of scaling to the necessary number of qubits. This necessitates the use of high-quality quantum states, which…
Scalable quantum photonic systems require efficient single photon sources coupled to integrated photonic devices. Solid-state quantum emitters can generate single photons with high efficiency, while silicon photonic circuits can manipulate…
A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…
Recent advances in the preparation, control and measurement of atomic gases have led to new insights into the quantum world and unprecedented metrological sensitivities, e.g. in measuring gravitational forces and magnetic fields. The full…
Modern high-definition LIDAR is expensive for commercial autonomous driving vehicles and small indoor robots. An affordable solution to this problem is fusion of planar LIDAR with RGB images to provide a similar level of perception…
We demonstrate a hybrid laser microfabrication approach, which combines the technical merits of ultrafast laser-assisted chemical etching and carbon dioxide laser-induced in-situ melting, for centimeter-scale and bonding-free fabrication of…
Lidar-based sensing drives current autonomous vehicles. Despite rapid progress, current Lidar sensors still lag two decades behind traditional color cameras in terms of resolution and cost. For autonomous driving, this means that large…
Dense and efficient circuits with component sizes approaching the physical limit is the hallmark of high performance integration. However, current fabrication technology is mostly constraint to 2D lithography, and thermal energy dissipation…
Quantum technologies promise profound advances in communication security, sensing and computing. The underpinning hardware must be engineered to generate, manipulate and detect quantum phenomena with exceptional performance, whilst being…
Robust environment perception for autonomous vehicles is a tremendous challenge, which makes a diverse sensor set with e.g. camera, lidar and radar crucial. In the process of understanding the recorded sensor data, 3D semantic segmentation…
Most recent approaches to monocular 3D human pose estimation rely on Deep Learning. They typically involve regressing from an image to either 3D joint coordinates directly or 2D joint locations from which 3D coordinates are inferred. Both…
The availability of high-speed 3D video sensors has greatly facilitated 3D shape acquisition of dynamic and deformable objects, but high frame rate 3D reconstruction is always degraded by spatial noise and temporal fluctuations. This paper…
The emerging hybrid integrated quantum photonics combines advantages of different functional components into a single chip to meet the stringent requirements for quantum information processing. Despite the tremendous progress in hybrid…
Dense 3D convolutions provide high accuracy for perception but are too computationally expensive for real-time robotic systems. Existing tri-plane methods rely on 2D image features with interpolation, point-wise queries, and implicit MLPs,…
Reliable perception of the environment plays a crucial role in enabling efficient self-driving vehicles. Therefore, the perception system necessitates the acquisition of comprehensive 3D data regarding the surrounding objects within a…
Although vast amounts of information are conveyed by photons in optical fibers, the majority of data processing is performed electronically, creating the infamous 'information bottleneck' and consuming energy at an increasingly…
The co-packaging of optics and electronics provides a potential path forward to achieving beyond 50 Tbps top of rack switch packages. In a co-packaged design, the scaling of bandwidth, cost, and energy is governed by the number of optical…
Integrated photonic devices made of silicon nitride (SiN), which can be integrated with silicon-on-insulator and III-V platforms, are expected to drive the expansion of silicon photonics technology. However, the relatively low refractive…
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such…