Related papers: Integration and Packaging
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer…
Three-dimensional elements, with refractive index distribution structured at sub-wavelength scale, provide an expansive optical design space that can be harnessed for demonstrating multi-functional free-space optical devices. Here we…
Silicon photonics provides a versatile platform for large-scale integration of optical functions, but its weak intrinsic nonlinear response limits the realization of active, intensity-dependent functionalities. Hybrid integration of…
With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in two-dimensional (2D)…
Photonic integrated circuits find ubiquitous use in various technologies, from communication, to computing and sensing, and therefore play a crucial role in the quantum technology counterparts. Several systems are currently under…
The next generation of collider experiments require tracking detectors with extreme performance capabilities in terms of spatial resolution (tens of $\mu \text{m}$), radiation hardness ($10^{17}~1~$MeV n$_{eq}/$cm$^2$) and timing resolution…
Silicon photonic integrated circuit (PIC) builds on the demand for a low cost approach from established silicon-based manufacturing infrastructure traditionally built for electronics. Besides its natural abundance, silicon has desirable…
An automated vehicle operating in an urban environment must be able to perceive and recognise object/obstacles in a three-dimensional world while navigating in a constantly changing environment. In order to plan and execute accurate…
As automation technologies advance, the need for compact and multi-modal sensors in robotic applications is growing. To address this demand, we introduce CompdVision, a novel sensor that employs a compound-eye imaging system to combine…
Three-dimensional integrated circuit (3D IC) pack-aging and heterogeneous integration have emerged as central pillars of contemporary semiconductor scaling. Yet, the multi-physics coupling inherent to stacked architectures manifesting as…
CMOS Image Sensors are experiencing significant growth due to their capabilities to be integrated in smartphones with refined image quality. One of the major contributions to the growth of image sensors is the innovation brought about in…
A study of 3D pixel sensors of cell size 50 {\mu}m x 50 {\mu}m fabricated at IMB-CNM using double-sided n-on-p 3D technology is presented. Sensors were bump-bonded to the ROC4SENS readout chip. For the first time in such a small-pitch…
We investigate theoretically photonic chips with monolithically integrated blue light sources. According to our evaluations, a group-III nitride light emitting heterostructure can be efficiently combined with silicon nitride waveguiding…
For large scale applications, hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the state of the art in pixel detector technology to date. They have been developed and start to be used as tracking…
The ability to tailor laser light on a chip using integrated photonics has allowed for extensive control over fundamental light-matter interactions in manifold quantum systems including atoms, trapped ions, quantum dots, and defect centers.…
3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM). However, the copper-based electrical…
We motivate a new canonical strategy for integrating photonic neural networks (NNs) by leveraging 3D printing. Our believe is that a NN's parallel and dense connectivity is not scalable without 3D integration. 3D additive fabrication…
Integrated photonics offers great potential for quantum communication devices in terms of complexity, robustness and scalability. Silicon photonics in particular is a leading platform for quantum photonic technologies, with further benefits…
In recent years there has been a resurgence of interest in our community in the shape analysis of 3D objects represented by surface meshes, their voxelized interiors, or surface point clouds. In part, this interest has been stimulated by…
Integrated photonics promises solutions to questions of stability, complexity, and size in quantum optics. Advances in tunable and non-planar integrated platforms, such laser-inscribed photonics, continue to bring the realisation of quantum…