Related papers: Integration and Packaging
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
Single-photon sources that are bright, pure, and interference-ready are essential for quantum communication and photonic quantum information processing, but many solid-state platforms still rely on bulky optical excitation, careful…
Millimeter-scale embedded sensing systems have unique advantages over larger devices as they are able to capture, analyze, store, and transmit data at the source while being unobtrusive and covert. However, area-constrained systems pose…
The technological transition from soft machines to soft robots necessarily passes through the integration of soft electronics and sensors. This allows for the establishment of feedback control systems while preserving the softness of the…
The transition towards designs which co-package electronic and photonic die together in data center switch packages has created a scaling path to Petabyte per second (Pbps) input/output (I/O) in such systems. In a co-packaged design, the…
Solid-state quantum emitters coupled to integrated photonic nanostructures are quintessential for exploring fundamental phenomena in cavity quantum electrodynamics and widely employed in photonic quantum technologies such as non-classical…
With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…
Aluminum oxide is a promising material for visible-light integrated photonics due to its low optical loss and wide transparency window across the RGB spectrum. This work presents the design and experimental demonstration of an integrated…
Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders requires the use of time information in tracking, due to the increasing levels…
For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation…
Photonic quantum technology can be enhanced by monolithic fabrication of both the underpinning quantum hardware and the corresponding electronics for classical readout and control. Together, this enables miniaturisation and mass-manufacture…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
The 3D silicon sensor has demonstrated excellent performances (signal collection, detection efficiency, power consumption, etc.) comparable or even better with respect to the traditional planar sensor of the ATLAS Detector at the Large…
The CLIC Tracker Detector (CLICTD) is a monolithic pixel sensor featuring pixels of 30um x 37.5um and a small collection diode. The sensor is fabricated in a 180 nm CMOS imaging process, using two different pixel flavours: the first with a…
This article describes the design and development of a system for remote indoor 3D monitoring using an undetermined number of Microsoft(R) Kinect sensors. In the proposed client-server system, the Kinect cameras can be connected to…
This paper presents the design and test results of a prototype monolithic pixel sensor manufactured in deep-submicron fully-depleted Silicon-On-Insulator (SOI) CMOS technology. In the SOI technology, a thin layer of integrated electronics…
When localizing and detecting 3D objects for autonomous driving scenes, obtaining information from multiple sensor (e.g. camera, LIDAR) typically increases the robustness of 3D detectors. However, the efficient and effective fusion of…
A large number of sensors deployed in recent years in various setups and their data is readily available in dedicated databases or in the cloud. Of particular interest is real-time data processing and 3D visualization in web-based user…
Highly granular pixel detectors allow for increasingly precise measurements of charged particle tracks. Next-generation detectors require that pixel sizes will be further reduced, leading to unprecedented data rates exceeding those foreseen…
Metamaterials are artificially engineered devices that go beyond the properties of conventional materials in nature. Metamaterials allow the creation of negative refractive indexes, light trapping with epsilon-near-zero compounds, bandgap…